Statistical Timing Analysis for IC NBTI Degradation

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Solution Overview

Problem

Integrated circuits (ICs) are susceptible to degradation due to operational stress, which can lead to malfunction over time, with transistors experiencing Negative Bias Temperature Instability (NBTI) and Channel Hot Carrier (CHC) degradation, and metal interconnects facing electromigration and Joule heating issues, making it challenging to maintain reliable IC performance.

Innovation Solution

The implementation of statistical timing analysis that accounts for stress degradation in IC design, specifically by identifying threshold voltage changes in transistors and formulating sensitivity models to measure delays caused by NBTI and CHC, and considering different time durations of stress exposure to enhance IC reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If statistical timing analysis is applied to account for stress degradation, then IC reliability is improved, but device complexity increases

Engineering Contradiction:
ImproveIC reliabilityVSAvoidanalysis complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies statistical timing analysis during the design phase to predict and account for stress degradation before the IC is fabricated and deployed. By performing timing analysis that incorporates degradation models in advance, the design can be adjusted to ensure reliability over the IC's operational lifetime without requiring complex real-time monitoring or adjustment mechanisms.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent modifies timing parameters and degradation models to incorporate stress effects such as NBTI and CHC. By changing the timing analysis to include degradation parameters (e.g., threshold voltage shifts, mobility changes) as functions of stress conditions, the system achieves more accurate reliability assessment while managing complexity through parameterization rather than fundamental architectural changes.

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If threshold voltage changes and delay measurements are performed for all transistors, then timing accuracy is improved, but manufacturing time increases

Engineering Contradiction:
Improvetiming accuracyVSAvoidmanufacturing time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent applies different levels of analysis to different transistors based on their criticality and stress exposure. Rather than uniformly analyzing all transistors, the statistical timing analysis identifies and focuses on critical paths and transistors that experience highest stress, applying more detailed degradation modeling where needed and simplified models where acceptable, thus achieving high timing accuracy for critical components without proportionally increasing overall manufacturing time.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent performs timing analysis with degradation accounting for a representative sample of critical transistors and paths rather than all transistors. By applying partial analysis to the most critical elements and using statistical generalization for less critical ones, the patent achieves sufficient timing accuracy while significantly reducing the time required compared to exhaustive analysis of every transistor.

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the design of ICs that are less susceptible to stress-related degradations, ensuring accurate timing analysis and potential failures are identified, allowing for remedial measures to be taken, thereby maintaining reliable IC performance over time.

Implementation Method 1

In case of transistors, degradation is caused due to a phenomenon commonly referred to as Negative Bias Temperature Instability (NBTI) in case of PMOS transistors

Methodology Applied
Scientific EffectNegative Bias Temperature Instability (NBTI):

Implementation Method 2

degradation is caused due to as Channel Hot Carrier (CHC) in case of NMOS transistors

Methodology Applied
Scientific EffectChannel Hot Carrier (CHC):

Implementation Method 3

In case of metal interconnects, the degradation is caused due to electromigration or Joule heating phenomenon

Methodology Applied
Scientific EffectElectromigration:

Implementation Method 4

In case of metal interconnects, the degradation is caused due to electromigration or Joule heating phenomenon

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS8255850B2Fabricating IC with NBTI path delay within timing constraints
Publication Date: 2012.08.28 TEXAS INSTRUMENTS INC
  • US8255850B2 patent drawing
  • US8255850B2 patent drawing
  • US8255850B2 patent drawing

AI summary

According to an aspect of the present invention, statistical timing analysis is applied with respect to a stress degradation that occurs in fabricated integrated circuits (IC) when used for a long duration. The circuit design may be suitably modified to account for the degradations (e.g., those caused by NBTI and CHC for transistors, those caused due to electromigration in case of interconnects). As a result, the fabricated ICs may be less susceptible to such degradations. The features are extended to model complex circuit blocks and also account for different degrees of stress that different circuit blocks are subjected to, in a same age of operation.