Integrated Circuit Non-Functional Metal Structures for Reverse Engineering Obfuscation
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Solution Overview
Problem
Security ICs face challenges in maintaining data integrity and confidentiality due to growing capabilities of re-engineering setups that aim to extract functionality, as current technologies rely on dummy structures which may not effectively deter unauthorized access.
Innovation Solution
Incorporating a combination of functional and non-functional metal structures connected via vias or physical contact within the same layer, with non-functional structures added to obfuscate the identification of functional structures, thereby increasing the complexity and error rate for reverse engineering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If dummy structures are used to fulfill density rules, then manufacturability is improved, but security against reverse engineering deteriorates
Solution Approach 1:
The patent combines dummy structures and functional structures into a single integrated layout where they are interspersed and connected through shared vias and metal lines. This merging makes it impossible for reverse engineers to distinguish which structures are functional and which are dummy, thereby maintaining manufacturability while significantly improving security against reverse engineering attacks.
2Reliability
If more via structures are used to establish connections, then electrical requirements are fulfilled, but device complexity increases
Solution Approach 1:
The patent designs via structures and metal lines that serve dual purposes: they connect functional structures to satisfy electrical requirements, and simultaneously connect dummy structures to fulfill density rules and obfuscate the layout. This multi-functionality reduces the need for separate dedicated dummy via structures, thereby maintaining electrical reliability while reducing overall device complexity.
3Object-affected harmful factors
If non-functional structures are added to obfuscate functional structures, then security is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies different connection strategies at different locations: in some areas, functional and dummy structures are connected through shared vias, while in other areas they are kept separate or connected through metal lines. This local variation in connection quality allows the layout to achieve high security through obfuscation while maintaining manufacturability by not requiring uniform high-precision connections throughout the entire chip.
Data Source
AI summary
An integrated circuit includes functional structures and non-functional structures. The functional structures include one or more functional metal structures. The non-functional structures include one or more non-functional metal structures. At least one of the one or more non-functional metal structures is connected to at least one of the one or more functional metal structures. For example, the at least one non-functional metal structure is connected to the at least one functional metal structure through a via. Alternatively, the at least one non-functional metal structure is connected to the at least one functional metal structure by physically contacting the at least one functional metal structure without using a via.