IC Module Oblique IO Layout for Mixed Metal Scheme Integration
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Solution Overview
Problem
The integration of various modules built by different designers into an integrated circuit (IC) device is challenging due to different metal schemes, including varying metal pattern directions and pitches, making it difficult to integrate or reuse modules effectively.
Innovation Solution
The use of oblique IO pins in IC modules allows for easier integration by providing routing flexibility, enabling the APR tool to access IO patterns from adjacent or same metal layers, and facilitating integration regardless of the metal direction, thus accommodating different metal schemes without requiring layout revisions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If modules are integrated using traditional horizontal and vertical metal schemes, then integration is possible within fixed metal direction constraints, but routing flexibility is limited and layout revisions are required when metal directions change
Solution Approach 1:
The patent introduces oblique metal layers at 45 degrees relative to the horizontal and vertical metal layers, adding a new dimensional orientation to the traditionally two-dimensional (horizontal/vertical) metal routing scheme. This allows IO patterns to be accessed from multiple directions (horizontal, vertical, and oblique), providing routing flexibility without requiring layout revisions when integrating modules with different metal schemes
Solution Approach 2:
The oblique IO patterns are designed to be accessible from multiple metal layers including horizontal, vertical, and oblique orientations. This multi-functional design allows the same IO pattern to be routed from different directions depending on the metal scheme being used, making the integration process universal across different design houses' metal schemes without requiring layout changes
2Adaptability or versatility
If modules are designed with fixed metal patterns and pitches by different designers, then each module maintains its own design specifications, but integration difficulty increases due to incompatible metal schemes
Solution Approach 1:
By adding oblique metal layers at 45 degrees to the traditional horizontal/vertical stacking, the patent creates a three-dimensional metal routing architecture. This allows modules designed with different metal patterns and pitches to be integrated by selecting appropriate access directions, reducing integration complexity while maintaining module reusability across different design specifications
Solution Approach 2:
The oblique IO patterns act as intermediaries between modules with different metal schemes. Instead of requiring direct horizontal or vertical alignment between modules, the oblique patterns provide an intermediate routing path that can accommodate various metal directions and pitches, simplifying the integration of modules from different designers
Data Source
AI summary
An integrated circuit (IC) device includes a substrate and a circuit region over the substrate. The circuit region includes at least one active region extending along a first direction, at least one gate region extending across the at least one active region and along a second direction transverse to the first direction, and at least one first input/output (IO) pattern configured to electrically couple the circuit region to external circuitry outside the circuit region. The at least one first IO pattern extends along a third direction oblique to both the first direction and the second direction.