Integrated Circuit Optical Element Package Design
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Solution Overview
Problem
Integrated circuit device packages face challenges in efficiently transmitting both electrical and optical signals, particularly in achieving high-speed signal transfer and optimal optical coupling efficiency without increasing package size or power consumption.
Innovation Solution
The optical package design includes a semiconductor chip with a reflective layer and micro-lens for optical signal transmission, a conductive bump for electrical signal transmission, and an optical fiber module, along with a molding member and index matching material to enhance optical coupling efficiency, and a package substrate for mounting the conductive bump, which allows for rapid electrical signal transmission and efficient optical signal transfer without additional optical transmitting members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If an additional optical substrate is included to increase optical signal transmission speed, then the optical signal transmission speed is improved, but the device complexity increases
Solution Approach 1:
The patent merges the optical element directly into the semiconductor chip, eliminating the need for a separate optical substrate. The optical element is formed within the chip structure itself, integrating optical and electrical signal transmission functions into a single device, thereby maintaining high optical signal transmission speed while reducing device complexity
Solution Approach 2:
The semiconductor chip is designed to perform multiple functions: it serves as both the electrical signal transmission substrate and the optical signal transmission medium. The optical element integrated within the chip enables the chip to handle both electrical and optical signals, reducing the need for additional specialized components
2Reliability
If a reflective layer is formed on the first surface to reflect optical signals, then the optical coupling efficiency is improved, but the manufacturing process complexity increases
Solution Approach 1:
The reflective layer is formed concurrently with the pad structure during the same manufacturing process step. By combining the formation of the reflective layer with the pad fabrication process, the patent achieves improved optical coupling efficiency without adding separate manufacturing steps, thereby maintaining ease of manufacture
Solution Approach 2:
The reflective layer is prepared in advance during the chip fabrication process before the optical element is assembled. This preliminary formation of the reflective layer ensures optimal optical coupling efficiency is achieved from the outset, while avoiding the need for additional post-assembly manufacturing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables rapid transmission of electrical signals and improves optical coupling efficiency, resulting in a compact, low-power integrated circuit device package with enhanced performance in signal transfer.
Implementation Method 1
the semiconductor chip may include a reflective layer on the first surface that is configured to reflect the optical signal toward the optical element
Implementation Method 2
the optical package may additionally include a micro-lens on the second surface of the semiconductor chip that is configured to concentrate the optical signal
Implementation Method 3
the optical package may include a reflective index matching material in the window
Data Source
AI summary
Integrated circuit device packages including optical elements are provided. The integrated circuit device package may include an integrated circuit device and a conductive pad on a first surface of the integrated circuit device. The conductive pad may be electrically connected to the integrated circuit device and may be configured to transmit an electrical signal. The integrated circuit device package may also include an optical element in the integrated circuit device and the optical element may be configured to transmit an optical signal through a second surface of the integrated circuit device that is opposite the first surface of the integrated circuit device.