IC Package Air Venting via Substrate Longitudinal Grooves
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Solution Overview
Problem
As semiconductor chips shrink, the risk of trapped air pockets in molding compounds increases due to reduced spaces between components, leading to potential damage and ventilation issues during chip package manufacturing, which existing methods have not adequately addressed.
Innovation Solution
The method involves using a mold chase with an air vent and a singulation substrate featuring longitudinal grooves parallel to each other, allowing the molding compound to flow over the air vent portion and into the grooves, ensuring proper air venting by pushing air out through the grooves, thereby reducing the incidence of air pockets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If chip size and component size are reduced to increase processing power in smaller devices, then processing power density is improved, but the risk of trapped air pockets in molding compound increases
Solution Approach 1:
The air vent portion is segmented into multiple longitudinal grooves that run parallel to each other, creating multiple separate air escape pathways. This segmentation ensures that air can be efficiently vented through multiple channels rather than a single pathway, preventing trapped air pockets even as component sizes shrink and spaces between them decrease.
Solution Approach 2:
The air vent portion extends in a direction substantially perpendicular to the flow direction of the molding compound, creating a three-dimensional air escape route. This dimensional approach allows air to be vented laterally through the grooves rather than relying solely on the forward flow path, effectively preventing air trapping in high-density component layouts.
2Volume of moving object
If spaces between components are reduced to achieve smaller chip packages, then device miniaturization is improved, but ventilation capability deteriorates
Solution Approach 1:
The air vent portion with longitudinal grooves is specifically positioned in regions where air trapping is most likely to occur, such as under integrated circuit dies and in areas with high component density. This localized ventilation structure provides targeted air escape pathways precisely where needed, maintaining effective ventilation despite reduced overall package size.
Solution Approach 2:
The air vent portion and longitudinal grooves are pre-formed in the substrate before the molding compound is applied. This preliminary preparation ensures that air escape pathways are already in place before components are positioned and molding begins, preventing air trapping from the outset rather than attempting to address it after the fact.
3Productivity
If molding compound flows quickly to improve manufacturing efficiency, then productivity is improved, but air pocket formation increases
Solution Approach 1:
The longitudinal grooves act as intermediary air escape channels that facilitate the rapid movement of air out of the molding zone. These grooves provide a dedicated pathway that allows air to be quickly evacuated as the molding compound flows in, preventing air pocket formation even at high flow speeds by mediating between the incoming compound and the trapped air.
Solution Approach 2:
The system utilizes fluid dynamics principles where the longitudinal grooves create a pressure gradient that facilitates rapid air evacuation. As molding compound flows into the package, it creates pressure that forces air through the grooves and out through the air vent portion, efficiently removing air pockets even during high-speed molding operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes air pockets under integrated circuit dies, ensuring proper ventilation and preventing damage by ensuring smooth flow and full coverage of the molding compound, even under high clamping forces or substrate thickness variations.
Implementation Method 1
flowing a molding compound on the singulation substrate and the integrated circuit die, the molding compound flowing over the air vent portion of the singulation substrate and into a portion of the longitudinal grooves, the molding compound pushing air out of the mold chase in the air flow direction through the longitudinal grooves
Data Source
AI summary
An integrated circuit packaging system, and a method of manufacture of an integrated circuit packaging system thereof, includes: a singulation substrate having an air vent portion having longitudinal grooves in the air vent portion, the longitudinal grooves all parallel to each other; an integrated circuit die attached to the singulation substrate; and a molding compound on the singulation substrate, on the air vent portion, in a portion of the longitudinal grooves, and on the integrated circuit die.