Integrated Circuit Package Antenna with Artificial Dielectric Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Antenna performance in mm-wave integrated circuit packages is compromised by surface wave losses and sensitivity to package dimensions, leading to reduced efficiency and asymmetric radiation patterns due to the propagation of guided waves within the package and coupling of radiated power with the integrated circuit die.
Innovation Solution
An integrated circuit package with a stacked arrangement of metal and dielectric layers, including a planar antenna and artificial dielectric layers formed by patterned metal shapes, which enhances antenna directionality and reduces surface wave losses by synthesizing high relative permittivity for normal radiation and low permittivity for parallel radiation, eliminating the need for external reflectors and improving radiation patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a reflector is implemented using external PCB metal layer, then antenna radiation directionality is improved, but manufacturing precision deteriorates due to dependency on soldering process and solder ball height variation
Solution Approach 1:
The reflector is merged with the package substrate itself, forming an integrated structure where the reflector is a built-in component of the package rather than an external element. This integration eliminates the need for separate soldering processes and external PCB metal layers, thereby improving manufacturing precision while maintaining radiation directionality.
Solution Approach 2:
A mediator structure is introduced between the antenna and the package substrate to precisely control the distance and positioning. This intermediary layer acts as a buffer that defines the reflector-antenna spacing through its thickness, independent of soldering variations, thus resolving the precision issue.
2Loss of energy
If mold thickness is increased to reduce surface wave loss, then antenna efficiency is improved, but device complexity and package size increase
Solution Approach 1:
The package substrate is designed with non-uniform properties - specifically, the region near the antenna is optimized to suppress surface waves through controlled impedance and material properties, while other regions maintain standard thickness. This localized optimization reduces surface wave loss without requiring overall increase in package thickness or complexity.
Solution Approach 2:
The electrical parameters of the package substrate are modified in the antenna vicinity, such as changing the dielectric constant or loss tangent locally, to suppress surface wave propagation. This parameter adjustment targets the specific problem area without affecting the entire package structure.
3Device complexity
If antenna is placed close to integrated circuit die, then device integration is improved, but antenna performance deteriorates due to power coupling with the die
Solution Approach 1:
The harmful electromagnetic coupling effect is extracted and redirected toward the reflector. The reflector captures the coupled energy that would otherwise be lost to the die and redirects it constructively, converting a harmful interaction into a useful component of the radiation pattern.
Solution Approach 2:
The electromagnetic coupling between the antenna and the integrated circuit die, which is normally harmful, is converted into a beneficial effect. By positioning the reflector appropriately, the coupled energy is reflected back to enhance the main radiation lobe, turning the parasitic coupling into a constructive contribution to antenna performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances antenna gain and directionality, reduces surface wave losses, and allows for a thinner package design with improved reliability and predictability, achieving up to 60% efficiency in desired radiation directions without the need for external reflectors.
Implementation Method 1
a first metal layer includes a planar antenna and at least one further metal layer comprises an artificial dielectric layer
Implementation Method 2
synthesizing high relative permittivity for normal radiation and low permittivity for parallel radiation
Implementation Method 3
surface wave losses and sensitivity to package dimensions, leading to reduced efficiency and asymmetric radiation patterns due to the propagation of guided waves within the package
Implementation Method 4
the planar antenna is configured to be electro-magnetically coupled to the antenna feed structure
Data Source
AI summary
An integrated circuit package is described comprising an integrated circuit die and an antenna structure coupled to the integrated circuit die and comprising a stacked arrangement of metal and dielectric layers, wherein a first metal layer includes a planar antenna and at least one further metal layer comprises an artificial dielectric layer. The integrated circuit package may improve the directionality of the antenna and reduces the sensitivity of the antenna to the printed circuit board on which the integrated circuit package is mounted.