IC Package Antenna Integration via Shield Vias
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Solution Overview
Problem
Integrating an external antenna with a system-in-package (SiP) is challenging due to the need for customization and compatibility with existing manufacturing infrastructure, while maintaining a small footprint and allowing for independent testing and assembly.
Innovation Solution
The integration of a radio frequency (RF) transceiver on a substrate within an IC package, with a shield layer and vias providing a conductive path, allows for a customizable antenna to be added externally post-testing, using existing manufacturing techniques like PoP, without increasing the substrate footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an external antenna is integrated with a system-in-package (SiP), then antenna performance and customization are improved, but the complexity of integration and assembly increases
Solution Approach 1:
The patent divides the antenna integration into separate modules: the SiP substrate with RF transceiver, the antenna element, and matching components. This segmentation allows independent design, testing, and assembly of each component, reducing integration complexity while maintaining customization capability.
Solution Approach 2:
The patent introduces an intermediary structure (substrate with vias and conductive paths) that facilitates the connection between the antenna and the RF transceiver. This intermediary enables standardized integration processes while supporting various antenna configurations.
2Adaptability or versatility
If an antenna is added to the SiP, then antenna functionality is improved, but the footprint of the substrate increases
Solution Approach 1:
The patent utilizes the vertical dimension by extending vias through the substrate thickness to connect the antenna to the RF transceiver. This three-dimensional approach allows antenna integration without increasing the substrate's planar footprint, maintaining compact form factor while enabling antenna functionality.
3Reliability
If the SiP is fully shielded and sealed, then EMI protection and reliability are improved, but post-assembly customization and testing become difficult
Solution Approach 1:
The patent incorporates vias and conductive paths into the substrate during the initial manufacturing process, before final sealing and shielding are applied. This preliminary preparation of interconnection structures enables subsequent antenna attachment and customization while maintaining the integrity of the shielded enclosure.
Data Source
AI summary
An antenna on integrated circuit (IC) package is disclosed. In an embodiment, an IC package comprises: a substrate; a radio frequency (RF) transceiver attached to the substrate; mold compound encapsulating the substrate; a shield layer formed on the mold compound; and one or more vias extending vertically through the shield layer and the mold compound, providing a conductive path to the RF transceiver. In another embodiment, a method comprises: attaching a radio frequency (RF) transceiver to a substrate; encapsulating the substrate with mold compound; forming a shield layer on the mold compound; and forming one or more vias through the shield layer and mold compound, providing a conductive path to the RF transceiver.