IC Package Antenna SMT Integration via Nested Housing
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Solution Overview
Problem
Conventional antenna structures are not easily integratable with Surface Mount Technology (SMT) due to difficulties in soldering electronic parts, hindering miniaturization and compactness in portable wireless communication equipment.
Innovation Solution
An IC package antenna is designed with a metal radiating member on a base board packaged within an IC housing, featuring connecting pins for soldering and a packaging bottom portion, allowing for standardized and miniaturized antenna design compatible with SMT, and integration of radio frequency elements for adjustable impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional antenna structures are used, then antenna function is achieved, but integration with Surface Mount Technology (SMT) is difficult due to soldering challenges
Solution Approach 1:
The patent merges the antenna structure with an IC package housing, creating a single integrated component. The antenna base board is enclosed within the IC packaging housing, and connecting pins extend from the housing to provide both mechanical support and electrical connection, eliminating the need for separate antenna assembly and soldering processes.
Solution Approach 2:
The IC packaging housing serves multiple functions: it protects the antenna base board, provides mechanical support, and acts as a mounting structure for SMT integration. The connecting pins simultaneously serve as structural elements and electrical connection points, enabling the antenna to be treated as a standard SMD component.
2Volume of moving object
If conventional antenna designs are used, then antenna performance is achieved, but miniaturization and compactness are hindered
Solution Approach 1:
The antenna base board is nested within the IC packaging housing, with the radiating member positioned inside the housing cavity. This nested configuration allows the antenna to be housed within a compact form factor while maintaining its functional dimensions, achieving miniaturization without compromising performance.
3Ease of manufacture
If standardized antenna design is implemented, then manufacturing consistency is improved, but adaptability to different frequency bands is reduced
Solution Approach 1:
The patent employs adjustable impedance matching circuits that can be tuned to adapt to different frequency bands. The standardized IC package housing and base board provide a consistent platform, while the integrated RF elements allow dynamic adjustment of electrical characteristics to match various operating frequencies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The IC package antenna achieves effective miniaturization and standardization, enabling efficient integration with SMT, and supports multiple frequency bands with improved impedance matching and performance as demonstrated by test results.
Implementation Method 1
the inner end of one connecting pin is soldering connected with a feed point of the base board of the antenna
Data Source
AI summary
An IC package antenna of which a metal radiating member is firstly provided on a base board to form an antenna base board; the antenna base board is formed thereon at least a feed point; and the IC package antenna is packaged with an IC packaging housing and a packaging bottom portion to form an IC chip. The IC packaging housing has a plurality of connecting pins extending outward from inside of itself; wherein the inner end of at least one connecting pin is soldering connected with a feed point of the base board of the antenna. Such an IC package antenna can allow standardized and miniaturized antenna designing, and is applicable to Surface Mount Technology (SMT).