IC Package Array Contacts with Insulated Bonding Wires

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Solution Overview

Problem

There is a need for integrated circuit packages that offer improved connectivity, reduced size, and lower costs to meet growing demand for smaller, cheaper, and faster electronic products, while existing solutions have not effectively addressed these requirements.

Innovation Solution

The method involves creating an integrated circuit packaging system with an array of leads including jumper leads and covered contacts, using insulated bonding wires to connect these leads and the integrated circuit die, and coupling bond wires between the die and the jumper leads, allowing for efficient signal connection and reduced thickness without additional substrate levels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional multi-layer substrate structures are used to achieve complex interconnect patterns, then connectivity is improved, but package thickness increases

Engineering Contradiction:

ImproveconnectivityVSAvoidpackage thickness

Core Design Contradiction:

Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The patent transitions from vertical stacking of multiple substrate layers to a planar array of contacts with jumper leads extending in the same plane. The insulated bonding wires create three-dimensional routing paths without requiring additional vertical layers, achieving complex interconnect patterns through spatial arrangement rather than layer multiplication.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If more connections are included to meet growing demand, then connectivity is improved, but manufacturing cost increases

Engineering Contradiction:

ImproveconnectivityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent divides the interconnect function into separate modular components: array contacts provide vertical access points, jumper leads provide horizontal routing, and insulated bonding wires provide selective electrical connections. This segmentation allows each component to be optimized independently and assembled through straightforward processes, reducing overall manufacturing complexity and cost.

Inventive Principle:

Principle #1Segmentation

3Volume of moving object

If package size is reduced to meet demand for smaller products, then compactness is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent employs thin insulated bonding wires that can be precisely positioned and routed within the compact package structure. These flexible wires allow for accurate electrical connections in reduced spaces without requiring high-precision rigid trace routing, maintaining manufacturability while achieving smaller package dimensions.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS8723338B2Integrated circuit packaging system with array contacts and method of manufacture thereof

Publication Date: 2014.05.13 STATS CHIPPAC LTD

AI summary

A method of manufacture of an integrated circuit packaging system includes: providing an array of leads having a jumper lead and a covered contact; coupling an insulated bonding wire between the jumper lead and the covered contact; attaching an integrated circuit die over the covered contact; and coupling a bond wire between the integrated circuit die and the jumper lead including coupling the integrated circuit die to the covered contact through the insulated bonding wire.