IC Package Assembly Tool Warpage Control
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Solution Overview
Problem
Integrated circuit (IC) packages experience warpage and non-uniform mechanical and thermal stresses during assembly due to variations in flatness and force application, leading to cracking, delamination, and hot spots caused by uneven thermal interface material distribution.
Innovation Solution
An assembly tool and method that includes a base assembly with a clamp and cover plate, where the clamp has a notch and aperture to ensure precise alignment and uniform force distribution, and a heater to efficiently cure adhesives and thermal interface materials, reducing warpage and mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical force is applied to the cover at elevated temperature during assembly, then the cover is bonded to the substrate, but warpage of the IC package is exasperated and non-uniform force is applied causing mechanical stresses
Solution Approach 1:
The patent applies a lateral offset distance parameter between the cover and substrate peripheral edge to control the distribution of mechanical stress and force during assembly. This parameter change allows uniform force application while maintaining bonding strength, resolving the contradiction between reliable bonding and warpage control.
2Reliability
If mechanical force is applied to the cover at elevated temperature during assembly, then the cover is bonded to the substrate, but cracking and delamination occur due to non-uniform heating
Solution Approach 1:
The lateral offset distance parameter is used to control the thermal and mechanical stress distribution during assembly. By optimizing this parameter, the patent achieves uniform heating and force application, preventing cracking and delamination while maintaining reliable bonding between the cover and substrate.
3Reliability
If the cover is mounted to the substrate, then the IC package is enclosed and protected, but non-uniform thermal interface material distribution creates hot spots
Solution Approach 1:
The lateral offset distance parameter controls the distribution of thermal interface material between the cover and substrate. By optimizing this parameter, the patent ensures uniform thermal contact and heat transfer, eliminating hot spots while maintaining package protection and enclosure integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes warpage and mechanical stress, ensuring uniform heat transfer and reducing the occurrence of hot spots, thereby enhancing the reliability and performance of the IC package by preventing cracking and delamination.
Implementation Method 1
a heater to efficiently cure adhesives and thermal interface materials
Implementation Method 2
The first integrated circuit (IC) die is mechanically and electrically coupled to the package substrate via solder connections
Data Source
AI summary
An integrated circuit (IC) package, assembly tool and method for assembling an IC package are described herein. In a first example, an IC package is provided that includes a package substrate, at least a first integrated circuit (IC) die and a cover. The first integrated circuit (IC) die is mechanically and electrically coupled to the package substrate via solder connections. The cover is bonded to the package substrate. The cover encloses the first IC die and is laterally offset from a peripheral edge of the package substrate.