IC Package Back Plate Compression for Hot Spot Heat Dissipation
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Solution Overview
Problem
Existing 3D IC packages fail to adequately address the thermal management requirements of high-performance computing and artificial intelligence applications, particularly in managing hot spot thermal dissipation within CPUs and GPUs, due to inefficiencies in heat dissipation and delamination issues caused by warping.
Innovation Solution
The implementation of a back plate configured to apply physical compression to IC packages, utilizing protrusion features and elastomer pads to secure the package components, thereby improving thermal contact and reducing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing 3D IC package configurations are used, then the package structure is simple and easy to manufacture, but thermal dissipation efficiency is insufficient to meet high power density requirements
Solution Approach 1:
The back plate is segmented into multiple protrusion features that can be independently configured to apply compression forces at different locations. This segmentation allows targeted thermal management at hot spots while maintaining overall structural simplicity and manufacturability.
Solution Approach 2:
The invention adds a vertical compression dimension by introducing protrusion features that extend from the back plate toward the die. This dimensional addition enables direct mechanical compression force application, transforming the thermal management approach from passive conduction to active compression-enhanced conduction.
2Temperature
If physical compression is applied to improve thermal contact, then heat dissipation improves, but manufacturing precision requirements increase
Solution Approach 1:
The protrusion features are designed with specific geometric parameters (height, width, spacing) that directly control the compression force applied to the die. By optimizing these parameters, the invention achieves reliable thermal contact while maintaining compatibility with existing manufacturing precision capabilities.
Solution Approach 2:
The protrusion features automatically self-adjust during assembly to provide optimal compression force. The mechanical design allows the protrusions to elastically deform and conform to the die surface, eliminating the need for precise external force control mechanisms and reducing manufacturing precision requirements.
3Reliability
If compression forces are applied to reduce warping and delamination, then reliability improves, but device complexity increases
Solution Approach 1:
The protrusion features serve multiple functions simultaneously: they apply compression force to improve thermal contact, prevent die warping, and reduce delamination risk. This multi-functionality achieves reliability improvement without adding separate components, thereby avoiding increased device complexity.
Solution Approach 2:
The compression mechanism is merged with the back plate structure itself rather than being a separate component. The protrusion features are integrally formed with or attached to the back plate, combining the structural support function with the compression function into a single element, thus maintaining simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation by maintaining consistent thermal contact and reducing warping, thus improving the thermal management capabilities of IC packages.
Implementation Method 1
a back plate configured to apply physical compression to the IC package
Implementation Method 2
utilizing protrusion features and elastomer pads to secure the package components
Data Source
AI summary
One aspect of the present disclosure pertains to an integrated circuit (IC) package assembly. The IC package assembly includes a printed circuit board (PCB); a packaged IC structure mounted on a top surface of the PCB; a heat sink structure disposed over the packaged IC structure; and a back plate secured on a bottom surface of the PCB. The back plate includes a base portion and a protruding portion. The protrusion portion protrudes from the base portion and a portion of the PCB is below the packaged IC structure. A lateral width of the protrusion portion is smaller than a lateral width of the base portion.