Integrated Circuit Package System with Backside Element

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Solution Overview

Problem

The challenge lies in developing an integrated circuit package system that balances miniaturization, increased functionality, and cost-effectiveness while avoiding yield and reliability issues such as chipping or cracking, which conventional approaches have not adequately addressed.

Innovation Solution

The solution involves attaching an external interconnect on a tape, a backside element adjacent to the interconnect, and an integrated circuit die with the backside element exposed, forming a specific encapsulation that protects the die from damage and provides planar rigidity, allowing for aggressive thinning and efficient packaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If conventional approaches are used to form very thin packages, then miniaturization and thinness are achieved, but integrated circuits are exposed from the encapsulation leading to chipping or cracking

Engineering Contradiction:

Improvepackage thicknessVSAvoidintegrated circuit integrity

Core Design Contradiction:

Length of stationary objectVSReliability

Solution Approach 1:

A backside element is attached to the passive side of the integrated circuit die before final encapsulation. This backside element acts as a cushioning layer that prevents chipping and cracking of the thin integrated circuit die during handling and operation, enabling the die to be thinned aggressively while maintaining reliability.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The package structure combines multiple materials including the integrated circuit die, a backside element (such as a support layer or protective coating), and encapsulation material. This composite structure provides both the thinness required for miniaturization and the protection needed to prevent damage to the exposed circuit.

Inventive Principle:

Principle #40Composite materials

2Productivity

If functional integration is pursued to achieve miniaturization, then device density increases, but packages with disparate devices result in undesirably large form factor

Engineering Contradiction:

Improvedevice integration densityVSAvoidpackage form factor

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

Multiple functional devices are integrated onto a single integrated circuit die rather than being packaged separately. This merging of functions into one die dramatically reduces the overall package form factor while maintaining high device integration density, avoiding the problem of large packages containing multiple disparate devices.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated circuit die is designed to perform multiple functions within a single device, allowing disparate functionalities to be combined in one compact package rather than requiring separate packages for each function, thus reducing the overall form factor.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8115305B2Integrated circuit package system with thin profile

Publication Date: 2012.02.14 STATS CHIPPAC LTD

AI summary

An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the integrated circuit die; connecting a first active side of the integrated circuit die and the external interconnect; and forming a first encapsulation over the integrated circuit die with the backside element exposed.