IC Package Bonding Lands for High Density
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Solution Overview
Problem
There is a need for integrated circuit package systems that achieve higher miniaturization, increased packaging density, and lower costs while maintaining reliability under severe operating conditions, as conventional semiconductor packages face challenges in shrinking size and improving performance.
Innovation Solution
The solution involves an integrated circuit die with die pads only adjacent a single edge, forming bonding lands, and encapsulating these pads and lands to create a thin, high-density package configuration, which includes a leadframe with bonding lands and connectors to achieve efficient signal transfer and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional semiconductor packages use molded resin encapsulation with leadframes, then structural integrity and protection are achieved, but package thickness and size increase
Solution Approach 1:
The patent replaces conventional thick molded resin encapsulation with a thin film protective layer formed directly over the bonding pads and die structure. This thin film provides necessary protection while minimizing package thickness, resolving the contradiction between structural integrity and reduced package size.
Solution Approach 2:
The patent extracts and eliminates the leadframe structure and excessive molded resin from conventional packages. By removing these bulky components and retaining only the essential bonding pads and thin protective film, the package thickness is dramatically reduced while maintaining core functionality and structural integrity.
2Area of stationary object
If die pads are distributed across the entire die surface, then electrical connectivity is maximized, but package area and size increase
Solution Approach 1:
The patent segments the die pad configuration into two distinct groups: bonding pads located at the periphery for electrical connection, and a separate active area for circuit functionality. This segmentation allows compact packaging while maintaining adequate electrical connectivity through the peripheral pad arrangement.
Solution Approach 2:
The patent transitions from a conventional planar distribution of pads across the die surface to a peripheral arrangement where pads are positioned along the edges. This dimensional reorganization maximizes electrical connectivity while minimizing the footprint and overall package area.
3Ease of manufacture
If multiple process steps (die-bonding, wire-bonding, molding, trimming) are used, then manufacturing completeness is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges multiple conventional process steps into a more integrated manufacturing flow. The thin film protective layer is formed in-situ over the bonding pads, combining protection and connection functions in a single process step, thereby reducing overall manufacturing complexity while maintaining process completion.
Solution Approach 2:
The bonding pad structure serves multiple functions simultaneously: electrical connection, mechanical support, and protection (through the integrated thin film). This multi-functionality eliminates the need for separate protective components and process steps, simplifying manufacturing while ensuring completeness.
Data Source
AI summary
An integrated circuit package system includes a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die, forming first bonding lands adjacent the single edge, connecting the die pads and the first bonding lands, and encapsulating the die pads and a portion of the first bonding lands to form a first package.