IC Package Brace Structure for Uniform Pressure and Heat Dissipation

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Solution Overview

Problem

The increasing density of input/output (I/O) pads on integrated circuit dies due to their miniaturization poses challenges in packaging, particularly in achieving uniform pressure distribution and thermal dissipation during the assembly of system-on-wafer assemblies.

Innovation Solution

A mechanical brace with a rigid layer and a soft layer is used to clamp the package structure between a thermal module and the mechanical brace, where the soft layer conforms to the underlying features, ensuring uniform pressure and improved thermal dissipation by reducing warpage and enhancing pressure uniformity across the thermal interface material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If integrated circuit dies are miniaturized to increase I/O pad density, then the number of I/O pads per unit area increases, but uniform pressure distribution during packaging becomes more difficult to achieve

Engineering Contradiction:

ImproveI/O pad densityVSAvoidpressure distribution uniformity

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

A soft layer is introduced between the mechanical brace and the package structure to act as a compliant interface. This soft layer deforms to conform to underlying features and ensures uniform pressure distribution across the thermal interface material, resolving the pressure uniformity issue that arises from miniaturized high-density I/O pads.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The soft layer serves as an intermediary element between the rigid mechanical brace and the package structure. It mediates the pressure transmission to ensure uniform distribution while allowing for variations in the underlying structure, thereby maintaining pressure uniformity despite increased I/O pad density.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Quantity of substance

If integrated circuit dies are miniaturized to increase I/O pad density, then the number of I/O pads per unit area increases, but thermal dissipation effectiveness deteriorates

Engineering Contradiction:

ImproveI/O pad densityVSAvoidthermal dissipation

Core Design Contradiction:

Quantity of substanceVSTemperature

Solution Approach 1:

The soft layer ensures intimate contact between the thermal interface material and the mechanical brace, eliminating air gaps and improving thermal coupling. This compliant interface maintains effective thermal dissipation pathways even as die size decreases and I/O pad density increases.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The soft layer provides localized compliance at the thermal interface, adapting to the specific geometry of underlying features. This localized adaptation ensures optimal thermal contact in critical areas while maintaining overall pressure uniformity across the high-density I/O pad structure.

Inventive Principle:

Principle #3Local quality

3Stability of the object's composition

If a mechanical brace is used to clamp the package structure, then warpage is reduced, but pressure uniformity across the thermal interface material may be compromised without a soft layer

Engineering Contradiction:

Improvewarpage reductionVSAvoidpressure uniformity

Core Design Contradiction:

Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

The soft layer is positioned between the rigid mechanical brace and the package structure to provide compliance. This allows the mechanical brace to effectively reduce warpage through rigid support while the soft layer simultaneously ensures uniform pressure distribution by deforming to match underlying features.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The mechanical assembly combines rigid and compliant materials - the rigid mechanical brace provides structural support and warpage control, while the soft compliant layer provides pressure uniformity. This composite structure resolves the contradiction between warpage reduction and pressure uniformity.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces warpage and improves thermal dissipation by ensuring uniform pressure distribution, thereby enhancing the thermal management of integrated circuit packages.

Implementation Method 1

the soft layer conforms to the underlying features

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Implementation Method 2

a thermal module physically and thermally coupled to the package component

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240371726A1Integrated Circuit Package and Method

Publication Date: 2024.11.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure; a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets; a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and bolts extending through the thermal module, the mechanical brace, and the package component.