IC Package Cavity Design for Height Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional integrated circuit package systems face challenges in miniaturization, yield, and reliability due to large size and space requirements, particularly in portable devices, and have not provided effective solutions for low-cost manufacturing and improved efficiency.
Innovation Solution
An integrated circuit package system is designed with a carrier having a first and second side, where an integrated circuit is mounted on the first side, an external interconnect is attached to the second side, and an encapsulation is formed around the circuit and interconnect, exposing the interconnect and creating a cavity, which allows for embedded external interconnects that provide structural support and reduce package height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional molding approaches are used to encapsulate integrated circuits, then protection and encapsulation are achieved, but package height and space requirements increase
Solution Approach 1:
The patent embeds the external interconnect within the encapsulation material itself, nesting the interconnect structure inside the molded compound rather than placing it externally. This nesting approach allows the interconnect to be surrounded by protective material while maintaining a compact overall package height, resolving the contradiction between encapsulation protection and package dimension constraints.
Solution Approach 2:
The patent transitions from conventional external interconnect placement to embedded interconnect positioning within the encapsulation volume. By utilizing the third dimension (depth within the mold compound) for interconnect placement rather than only external surface mounting, the design achieves both protective encapsulation and reduced external package height.
2Productivity
If package level stacking or package on package designs are used, then packaging density increases, but height and space requirements increase
Solution Approach 1:
The patent utilizes the vertical dimension within the encapsulation material to embed external interconnects, enabling three-dimensional integration without increasing external package height. This approach allows multiple interconnect layers to be stacked within the encapsulation volume, increasing packaging density while maintaining compact external dimensions.
3Adaptability or versatility
If external interconnects are fully exposed, then connectivity is achieved, but structural support and reliability are reduced
Solution Approach 1:
The patent nests the external interconnect within the encapsulation material, surrounding the interconnect with protective mold compound while leaving necessary portions exposed for electrical connection. This nested configuration provides both structural support through the encapsulation material and maintained connectivity through controlled exposure, resolving the contradiction between structural integrity and electrical accessibility.
Data Source
AI summary
An integrated circuit package system includes providing a carrier having a first side and a second side; mounting an integrated circuit over the carrier with the first side facing the integrated circuit; attaching an external interconnect to the second side; and forming an encapsulation over the integrated circuit and around the external interconnect with the external interconnect exposed from the encapsulation and with the encapsulation and the second side forming a cavity.