Cavity Structures in IC Package Supports for Power Delivery
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Solution Overview
Problem
Existing IC package substrates with embedded copper blocks limit electrical connections to IC components, constraining design flexibility and performance, especially in high-performance computing applications.
Innovation Solution
The introduction of cavity structures in IC package supports with conductive contacts and peripheral materials allows for efficient power delivery and signal routing, enabling the integration of larger IC components by eliminating the need for copper blocks at the cavity bottom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper blocks are embedded at the bottom of cavities in IC package substrates, then electrical connections can be established, but design flexibility is constrained and performance is limited
Solution Approach 1:
The patent removes the copper block from the cavity bottom and replaces it with conductive posts extending through the substrate. This extraction of the copper block eliminates the constraint it imposed on design flexibility while maintaining electrical connection functionality through the conductive posts and vias structure.
Solution Approach 2:
The electrical connection path is segmented into multiple components: conductive posts at the cavity bottom, conductive vias extending through the substrate, and trace routing layers. This segmentation allows independent optimization of each component and provides greater design flexibility compared to a monolithic copper block.
2Reliability
If copper blocks are used for power delivery, then electrical connections are established, but power pathways become longer and more lossy
Solution Approach 1:
The patent transitions from planar power delivery through copper blocks to three-dimensional power pathways using conductive posts extending vertically through the substrate. This dimensional change enables shorter, more direct power delivery paths, reducing inductance and resistance, thereby decreasing power delivery loss.
3Ease of manufacture
If copper blocks are embedded in the substrate, then IC components can be mounted, but larger IC components cannot be accommodated
Solution Approach 1:
By removing the copper block that occupied the cavity bottom space, the patent creates sufficient room to accommodate larger IC components. The electrical connection function is maintained through the conductive posts and vias, which have a smaller footprint than the copper block, thus resolving the space constraint.
Data Source
AI summary
Disclosed herein are cavity structures in integrated circuit (IC) package supports, as well as related methods and apparatuses. For example, in some embodiments, an IC package support may include: a cavity in a dielectric material, wherein the cavity has a bottom and sidewalls; conductive contacts at the bottom of the cavity, wherein the conductive contacts include a first material; a first peripheral material outside the cavity, wherein the first peripheral material is at the sidewalls of the cavity and proximate to the bottom of the cavity, and the first peripheral material includes the first material; and a second peripheral material outside the cavity, wherein the second peripheral material is at the sidewalls of the cavity and on the first peripheral material, and the second peripheral material is different than the first peripheral material.