Profiled IC Package Coating for Heat Dissipation
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Solution Overview
Problem
The existing integrated circuit packages face challenges in heat dissipation due to the resin coating, which acts as a weak point in thermal conductivity, particularly when heat is evacuated from the top of the package.
Innovation Solution
The package design involves reducing the thickness of the resin coating locally in specific regions to enhance heat dissipation while maintaining robustness, using a heat sink mounted on a profiled top face of the coating with a thermally conductive adhesive layer, and optionally featuring profiled or planar surfaces to optimize heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the coating resin thickness is reduced locally in the heat volume space, then heat dissipation is enhanced, but the mechanical robustness of the package may be compromised
Solution Approach 1:
The coating resin thickness is varied locally across different regions of the package. Specifically, the coating is thinner in the heat volume space above the chip where heat dissipation is critical, and thicker in peripheral regions where mechanical strength is needed. This spatial variation in coating thickness allows simultaneous optimization of thermal performance and mechanical robustness.
2Reliability
If the coating resin thickness is reduced to improve thermal conductivity, then the thermal chain is reduced, but the protective function and robustness of the coating is degraded
Solution Approach 1:
The coating resin is designed with non-uniform thickness distribution, being locally thinned in specific zones where heat evacuation is prioritized, while maintaining sufficient thickness in other zones to preserve mechanical protection and structural integrity.
Solution Approach 2:
The coating resin is effectively segmented into functional zones: a first region with reduced thickness for optimal heat dissipation and a second region with greater thickness for mechanical protection. This segmentation allows each zone to fulfill its specific function without compromising the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the thermal resistance of the package, allowing for enhanced heat dissipation by up to 20% without compromising the mechanical robustness of the package, thereby maintaining a safe maximum junction temperature for the integrated circuit.
Implementation Method 1
a heat sink, generally metallic, mounted on the profiled top face of the coating by a mounting layer, for example a layer of adhesive or a layer of an interface material, preferably heat conducting
Implementation Method 2
reducing the thickness of the coating resin inside the heat volume space makes it possible to enhance the heat dissipation of the package
Data Source
AI summary
An integrated circuit package includes a base substrate with at least one electronic chip mounted on a face of the base substrate. The electronic chip is configured to have hot spots in operation emitting heat in a heat volume space. A coating encapsulates the at least one electronic chip. The coating has a bottom face mounted on the face of the base substrate and a profiled top face. A portion of the profile top face is configured to locally reduce a volume of a region of the coating. The portion is located at least in part in the heat volume space. A heat sink is mounted on the profiled top face of the coating using a mounting layer.