IC Package Conductive Plate for Low Resistance and Thermal Dissipation
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Solution Overview
Problem
Current IC packages for AC/DC converters face challenges in achieving optimal electrical and thermal characteristics while maintaining mechanical robustness, particularly in preventing delamination and efficiently dissipating heat.
Innovation Solution
The integration of a conductive plate with a plane surface electrically connected to one or more pins and a first die, which also serves as a heat dissipator and parasitic minimizer, allowing for improved electrical and thermal performance by maximizing contact areas and eliminating the need for wirebonds, and enabling the inclusion of a third die for further miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirebonds are used to connect the die to pins, then the electrical connection is established, but the resistance and inductance are high and thermal dissipation is inefficient
Solution Approach 1:
The patent merges the electrical connection function and thermal dissipation function into a single integrated structure. The conductive plate directly connects the first die to the pins, eliminating wirebonds, while simultaneously serving as a heat dissipation path from the die to the external environment.
Solution Approach 2:
The conductive plate performs multiple functions: it provides low-resistance electrical connection between the die and pins, serves as a heat dissipation pathway, and provides mechanical support. This multi-functionality resolves the contradiction by combining electrical and thermal management in one component.
2Adaptability or versatility
If a single IC package contains multiple dies, then additional functionalities are achieved, but the package size and complexity increase
Solution Approach 1:
The patent arranges multiple dies in a three-dimensional configuration on the conductive plate rather than spreading them out in two dimensions. This vertical stacking approach increases functional integration while minimizing the horizontal footprint and overall package complexity.
3Temperature
If the contact area between the conductive plate and die is maximized, then thermal dissipation is enhanced, but the manufacturing precision requirements increase
Solution Approach 1:
The patent changes the geometric parameters of the conductive plate and die contact surfaces to optimize both thermal dissipation and manufacturing feasibility. By carefully selecting the contact area dimensions and shape, the design achieves effective thermal coupling without requiring excessive manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves low resistance and inductance electrical connections, enhanced heat dissipation, and increased mechanical reliability, reducing production costs and preventing delamination, while allowing for additional functionalities in a single IC package.
Implementation Method 1
The conductive plate is electrically connected to the one or more pins. The plane surface of the conductive plate is electrically connected to a plane surface of the first die such that an electrical connection is established between the first die and the one or more pins
Implementation Method 2
thermal considerations need to be taken into account. It is the duty of the IC package to provide effective heat dissipation away from a die
Implementation Method 3
The conductive plate having a plane surface electrically connected to one or more pins and a first die, which also serves as a heat dissipator
Data Source
AI summary
An integrated circuit IC package with one or more pins protruding from the IC package for electrically connecting the IC package with a printed circuit board PCB is presented. The IC package has a first die with a first electronic component, a second die with a second electronic component, and a conductive plate having a plane surface. The first electronic component may be a semiconductor power device and the second electronic component may be a control circuit. The plane surface of the conductive plate is electrically connected to both a plane surface of the first die and one or more pins such that an electrical connection is established between the first die and the one or more pins. The second die may be arranged on top of the conductive plate. Alternatively, a third die with a third electronic component may be arranged on top of the conductive plate.