IC Package Isolated Contact Protrusion Solder Lock
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Solution Overview
Problem
Traditional electrical connections in integrated circuit packaging are prone to delamination and breaking under stress due to adhesion inefficiencies, leading to reliability and yield issues, especially as electronic devices demand smaller, thinner, and more complex designs.
Innovation Solution
The development of an integrated circuit packaging system featuring isolated contacts and die paddles with protrusions having specific surface and sidewall structures, which enhance the physical locking of solder, thereby increasing resistance to multidirectional and shear forces, and the use of encapsulation to protect these connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional adhesion-based electrical connections are used, then the connection structure is simple, but the connection is prone to delamination and breaking under stress
Solution Approach 1:
The contact protrusion features a curved surface geometry instead of a flat contact interface. This curvature allows the solder to conform and wrap around the protrusion, creating a mechanical interlock that resists delamination and breaking under stress, while maintaining a relatively simple overall connection structure.
Solution Approach 2:
The invention transitions from a two-dimensional flat contact interface to a three-dimensional protruding contact structure. The contact protrusion extends vertically from the contact pad, creating a mechanical lock that engages with the solder in multiple dimensions, thereby improving reliability without significantly increasing structural complexity.
2Strength
If more adhesion material is applied to improve connection strength, then the adhesion efficiency increases, but the likelihood of short circuit increases
Solution Approach 1:
The curved surface of the contact protrusion allows solder to wrap around it, increasing the effective contact area and adhesion strength without requiring additional adhesion materials. The solder conforms to the curvature, creating a strong mechanical and metallurgical bond while maintaining precise electrical isolation.
Solution Approach 2:
The invention changes the geometric parameters of the contact structure by introducing a protrusion with specific dimensions and curvature. This geometric modification increases the surface area for solder attachment and creates a mechanical interlock, thereby improving connection strength without adding more adhesion material and avoiding short circuit risks.
3Volume of moving object
If packages are made smaller and thinner to meet product demands, then the device size is reduced, but the robustness of connections deteriorates
Solution Approach 1:
The contact protrusion utilizes the vertical dimension to create a mechanical interlock with the solder, compensating for the reduced planar area available in smaller and thinner packages. This three-dimensional structure provides robust connection strength even when the package footprint is minimized.
Solution Approach 2:
The curved surface of the contact protrusion allows solder to wrap around and mechanically lock onto the structure, providing enhanced connection robustness in compact packages where traditional flat connections would be too fragile.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming an isolated contact having a contact protrusion, the contact protrusion having a lower protrusion surface, an upper protrusion surface, and a protrusion sidewall; forming a die paddle, adjacent to the isolated contact, having a die paddle protrusion, the die paddle protrusion having a lower die protrusion surface, an upper die protrusion surface, and a die protrusion sidewall; depositing a contact pad on the contact protrusion; depositing a die paddle pad on the die paddle protrusion; coupling an integrated circuit die to the contact protrusion; and molding an encapsulation on the integrated circuit die.