IC Package Cooling Structure for High-Density Die Heat Dissipation
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Solution Overview
Problem
Existing integrated circuit packages face challenges in effectively managing heat dissipation as integration density increases, leading to performance and reliability issues.
Innovation Solution
A cooling system is integrated over the integrated circuit die components, utilizing a material with high thermal conductivity and enclosed compartments with pins and a coolant distribution network to transfer heat to a liquid coolant, enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integration density of electronic components is increased, then more components can be integrated into a given area, but heat dissipation becomes less effective leading to performance and reliability issues
Solution Approach 1:
The cooling system is divided into multiple enclosed compartments, each serving a specific cooling zone. This segmentation allows targeted heat management for different regions of the integrated circuit package, improving overall heat dissipation efficiency while maintaining high integration density
Solution Approach 2:
A coolant distribution network acts as an intermediary between the heat-generating integrated circuit components and the cooling fluid. This network efficiently transfers heat from multiple sources to the coolant, resolving the heat dissipation challenge associated with high integration density
2Temperature
If a cooling system is integrated over integrated circuit die components, then heat transfer efficiency is improved, but device complexity increases
Solution Approach 1:
The cooling system is merged with the package substrate, integrating cooling functionality directly into the structural foundation of the package. This combination reduces overall device complexity by eliminating separate cooling structures while maintaining effective heat transfer from integrated circuit components
Solution Approach 2:
The package substrate serves multiple functions: it provides structural support for the integrated circuit components and simultaneously acts as the base for the cooling system with enclosed compartments. This multi-functionality reduces device complexity by consolidating structural and thermal management roles into a single component
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling system effectively transfers heat generated by the integrated circuit dies, improving performance and reliability by maintaining optimal operating temperatures.
Implementation Method 1
A lower portion of the cooling system may be formed of a material with a high thermal conductivity and may comprise enclosed compartments with pins protruding from bottoms of the enclosed compartments over each of the one or more integrated circuit die components
Implementation Method 2
The heat generated by the integrated circuit dies or the stacks of the integrated circuit dies may be effectively transferred to a liquid coolant flowing through the cooling system directed by the coolant distribution network
Data Source
AI summary
An integrated circuit package and the method of forming the same are provided. The integrated circuit package may comprise a substrate, a first package component bonded to the substrate and a first cooling system over the first package component. The first package component may comprise a first semiconductor die. The first cooling system may comprise a first base over the first package component, wherein the first base may comprise a first recess, a first pin protruding from a bottom of the first recess, and a first raised portion encircling the recess in a top-down view; a lid over the first base, wherein the lid may be spaced apart from the first pin; and a sealant connecting the lid to the first raised portion of the first base.