IC Package Crack Stopper Structure for Stress Cycle Reliability

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Solution Overview

Problem

Existing gap fill materials in semiconductor packaging are prone to cracking during stress cycles, which can damage integrated circuit dies and induce process failures.

Innovation Solution

A crack stopper structure is provided to envelop the integrated circuit die, comprising a single or multi-layer dielectric structure that acts as a stress relief point to prevent or reduce crack propagation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If gap fill materials are used to fill spaces in integrated circuit packages, then the packaging density is improved, but the reliability deteriorates due to cracking during stress cycles

Engineering Contradiction:

Improvepackaging densityVSAvoidcrack resistance

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The gap fill material is segmented into multiple discrete beads rather than a continuous material. These beads are positioned in the gaps between integrated circuit components, providing fill functionality while the discrete nature prevents crack propagation that would occur in continuous materials under stress cycles.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The gap fill beads exhibit local quality differences in their physical and chemical properties. Each bead can be tailored with specific material compositions, sizes, and mechanical properties suitable for its local position and the specific stress conditions it will encounter, optimizing both density and crack resistance at different locations within the package.

Inventive Principle:

Principle #3Local quality

2Quantity of substance

If iterative reduction of minimum feature size is implemented, then the integration density is improved, but the manufacturing complexity increases

Engineering Contradiction:

Improveintegration densityVSAvoidmanufacturing complexity

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The gap fill beads are designed to self-position and self-align within the package structure during assembly. Their discrete nature and physical properties enable them to automatically fill gaps without requiring complex manufacturing processes, thereby achieving high integration density while avoiding increased manufacturing complexity.

Inventive Principle:

Principle #25Self-service

3Device complexity

If a single-layer dielectric structure is used for the crack stopper, then the device complexity is reduced, but the reliability is compromised compared to multi-layer structures

Engineering Contradiction:

Improvestructure complexityVSAvoidcrack prevention effectiveness

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The single-layer dielectric structure acts as an intermediary between the gap fill beads and the integrated circuit components. This dielectric layer provides stress relief and crack stopping functionality by absorbing and distributing mechanical stresses, preventing cracks from propagating to the sensitive circuit components while maintaining structural integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20250349750A1Integrated circuit packages and methods of forming the same

Publication Date: 2025.11.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Embodiments include a crack stopper structure surrounding an embedded integrated circuit die, and the formation thereof. The crack stopper structure may include multiple layers separated by a fill layer. The layers of the crack stopper may include multiple sublayers, some of the sublayers providing adhesion, hardness buffering, and material gradients for transitioning from one layer of the crack stopper structure to another layer of the crack stopper structure.