IC Package Bonding Layer Layout for CTE Mismatch Delamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in achieving reliable bonding integrity between upper and lower integrated circuit dies due to coefficient of thermal expansion (CTE) mismatch between the dies and the encapsulant, which can lead to delamination during manufacturing and operation.
Innovation Solution
The implementation of dummy die connectors over interfaces between lower integrated circuit dies and the lower gap-fill layer helps to mitigate the effects of CTE mismatch, ensuring better bonding integrity between upper and lower dies by eliminating or reducing the risk of delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dummy die connectors are placed over interfaces between lower integrated circuit dies and lower gap-fill layer, then bonding integrity between upper and lower dies is improved, but device complexity increases
Solution Approach 1:
Dummy die connectors serve as intermediary structures placed at the interfaces between lower integrated circuit dies and lower gap-fill layer. These dummy connectors act as mediators that distribute and mitigate the stress caused by CTE mismatch, preventing delamination of upper dies while maintaining bonding integrity. The dummy connectors are electrically isolated but structurally essential for stress management in the package.
2Stability of the object's composition
If dummy die connectors are added to mitigate CTE mismatch effects, then manufacturing stability is improved, but manufacturing precision requirements increase
Solution Approach 1:
Dummy die connectors are formed during the manufacturing process before final assembly, allowing their positions to be pre-established at critical interfaces. This preliminary action ensures that the stress-mitigating structures are in place before upper dies are bonded, improving manufacturing stability. The connectors are formed as part of the bonding layer structure, integrating their placement into existing process steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of the integrated circuit package by reducing the impact of CTE mismatch, thereby improving the manufacturing and operational stability of the package.
Implementation Method 1
By forming the dummy die connectors directly over interfaces between the lower integrated circuit dies and the lower gap-fill layer, the effect of the coefficient of thermal expansion (CTE) mismatch between the lower integrated circuit dies and the lower gap-fill layer on the bonding integrity between the upper integrated circuit dies and the bonding layer as well as the die connectors may be eliminated or reduced
Data Source
AI summary
An integrated circuit package and the method of forming the same are provided. The integrated circuit package may include a first die, a first gap-fill layer along sidewalls of the first die, a first bonding layer on the first die and the first gap-fill layer, and a first die connector in the first bonding layer. The first die connector may be directly over an interface between the first die and the first gap-fill layer.