IC Package Device Cavity Segmentation for Miniaturization
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Solution Overview
Problem
The electronics industry faces challenges in manufacturing smaller, thinner, and more cost-effective integrated circuit packages with improved yield and reliability, as conventional methods struggle to meet the demands of miniaturization and increased functionality in portable devices.
Innovation Solution
The integrated circuit package system involves connecting an integrated circuit die with external interconnects, forming a first encapsulation with a device cavity, mounting a device over the die, and creating a cover to form a hermetic interface, which enhances packaging density and reliability while reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional molding processes are used to encapsulate the semiconductor die, then the package can be formed with basic protection, but the package size and thickness cannot be sufficiently reduced to meet miniaturization requirements
Solution Approach 1:
The encapsulation is divided into two separate parts: a first encapsulation formed around the semiconductor die and inner leads, and a second encapsulation formed around the outer leads. This segmentation allows each encapsulation to be optimized independently for size and protective function, enabling reduced overall package volume while maintaining reliability.
Solution Approach 2:
The patent transitions from a single bulk encapsulation to a multi-layer encapsulation structure with the first and second encapsulations arranged in different spatial dimensions. This dimensional change enables better space utilization and thinner profile while providing equivalent or improved protection.
2Length of stationary object
If the package thickness is reduced to meet portable device requirements, then portability is improved, but manufacturing complexity and difficulty increase
Solution Approach 1:
The lead frame is divided into inner leads and outer leads, with the semiconductor die mounted on inner leads. The first encapsulation protects only the die and inner leads, while the second encapsulation protects the outer leads. This segmentation enables thinner overall package thickness while simplifying the manufacturing process for each encapsulation step.
Solution Approach 2:
The first encapsulation is formed preliminarily around the semiconductor die and inner leads before the second encapsulation is formed around the outer leads. This preliminary action allows each encapsulation to be optimized for its specific function and enables a thinner overall package structure.
3Adaptability or versatility
If more functions and integrated circuits are packed into QFP packages to increase functionality, then product capability improves, but manufacturing yield decreases
Solution Approach 1:
The package structure segments different functional components (semiconductor die, inner leads, outer leads) into distinct encapsulation zones. This segmentation allows each component to be independently protected and managed, enabling higher functionality integration while maintaining manufacturing yield through simplified processing of each segment.
Data Source
AI summary
An integrated circuit package system is provided including connecting an integrated circuit die with an external interconnect, forming a first encapsulation having a device cavity with the integrated circuit die therein, mounting a device in the device cavity over the integrated circuit die, and forming a cover over the device and the first encapsulation.