IC Package Surface Treatment for Clean Die Singulation

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Solution Overview

Problem

The challenge in semiconductor manufacturing is the inability to effectively separate integrated circuit dies from a wafer due to the deposition of protective layers in trenches during the singulation process, leading to manufacturing defects and reduced yield.

Innovation Solution

A fluorine-based surface treatment is applied to the trenches to create hydrophobic sidewalls, preventing the deposition of protective layers and enabling clean separation of the dies during planarization, followed by a cleaning process to remove residual protective layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protective layer is deposited over the wafer during singulation, then the integrated circuit dies are protected from damage, but the protective layer is also deposited in the trenches, preventing clean separation of the dies

Engineering Contradiction:

Improveprotection of integrated circuit diesVSAvoidseparation of integrated circuit dies

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies a hydrophobic surface treatment specifically to the trench regions, creating a local property difference between the trench sidewalls and other surfaces. This localized treatment prevents protective layer deposition in the trenches while allowing deposition elsewhere, enabling clean die separation without compromising overall protection

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The hydrophobic surface treatment acts as an intermediary layer on the trench sidewalls that prevents the protective layer from adhering in the trench regions. This intermediary property allows the protective layer to be deposited on die surfaces for protection while excluding it from trench areas where it would interfere with separation

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the protective layer is deposited in the trenches, then the integrated circuit dies are protected, but the separation process becomes difficult and manufacturing defects increase

Engineering Contradiction:

Improveprotection of integrated circuit diesVSAvoidseparation process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The hydrophobic surface treatment creates a localized property difference in the trench regions, making them resistant to protective layer deposition. This local modification simplifies the separation process by ensuring trenches remain free of protective layer material that would complicate die extraction

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent converts the potential harm of protective layer deposition into a benefit by using the hydrophobic surface treatment to selectively prevent deposition in trenches. The protective layer deposition process itself becomes beneficial by filling trenches with the treatment, creating a clear boundary that facilitates separation

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Productivity

If conventional singulation processes are used, then manufacturing can proceed, but yield is reduced due to manufacturing defects from incomplete separation

Engineering Contradiction:

Improvemanufacturing throughputVSAvoidseparation quality

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The hydrophobic surface treatment is applied to the trenches before the protective layer deposition step. This preliminary action ensures that when the protective layer is subsequently deposited, the trenches are already prepared to reject the material, preventing defects before they occur and ensuring high-yield separation

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method improves yield and reduces manufacturing defects by ensuring clean separation of integrated circuit dies, enhancing the packaging process efficiency.

Implementation Method 1

performing a surface treatment in the trenches to form surface regions on the sidewalls of the trenches. The surface regions may be hydrophobic

Methodology Applied

Scientific EffectHydrophobic surface treatment: Hydrophobe

Data Source

PatentUS20250316569A1Surface treatment in integrated circuit package and method

Publication Date: 2025.10.09 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package includes a first integrated circuit die and a second integrated circuit die over and bonded to the first integrated circuit die. A first surface region of the second integrated circuit die is hydrophobic, and the first integrated circuit die and the second integrated circuit die are bonded together with dielectric-to-dielectric bonds and metal-to-metal bonds. The package further includes a first insulating material over the first integrated circuit and surrounding the second integrated circuit die. The first insulating material contacts the first surface region.