IC Package Suspension Structure for Semiconductor Die Stress Relief
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Solution Overview
Problem
Integrated circuit packages exert stress on semiconductor dies due to material differences and movement, impacting the performance of electronic components on the die.
Innovation Solution
The integrated circuit packages reduce stress by mechanically isolating the semiconductor die through minimal contact and using flexible materials and connectors with specific properties to minimize displacement, along with adhesives and substrates with matching thermal expansion coefficients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor die is directly mounted on the base substrate, then the electrical connection is simple and direct, but the stress on the semiconductor die increases due to movement and thermal expansion differences
Solution Approach 1:
The patent introduces a suspension gap as an intermediary space between the semiconductor die and the base substrate. This gap allows the die to be mechanically isolated while maintaining electrical connections through connectors, thereby reducing stress transmission from the package to the die during movement or thermal expansion.
Solution Approach 2:
The patent segments the mechanical support function from the electrical connection function. The semiconductor die is suspended above the base substrate rather than being directly mounted, with electrical connections provided through separate connectors. This segmentation allows independent optimization of mechanical stress reduction and electrical connectivity.
2Stress or pressure
If the semiconductor die is suspended above the base substrate to reduce stress, then the stress on the die is minimized, but the structural complexity increases
Solution Approach 1:
The connectors in the patent serve multiple functions: they provide electrical connections between the semiconductor die and the base substrate, and they also act as mechanical support elements that maintain the suspension gap. This multi-functionality reduces the need for additional dedicated support structures, thereby limiting the increase in structural complexity.
3Stress or pressure
If connectors are used to provide electrical connections in the suspended configuration, then the stress transmission is reduced, but the number of components and manufacturing steps increases
Solution Approach 1:
The patent merges the electrical connection function and the mechanical support function into a single connector component. This integration reduces the total number of separate components that would otherwise be needed (such as separate mounting structures and connection elements), thereby simplifying the manufacturing process despite the suspended configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes stress on the semiconductor die, improving the performance and reliability of electronic components by reducing mechanical contact and absorbing/distributing stress effectively.
Implementation Method 1
an adhesive layer made from a material having a modulus of elasticity between 0.1 gigapascals (GPa) and 3 GPa
Implementation Method 2
an adhesive layer made from a material having a loss tangent between 0.05 and 0.5
Data Source
AI summary
An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.