Integrated Circuit Package Suspension for Die Stress Isolation
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Solution Overview
Problem
Integrated circuit packages exert stress on semiconductor dies due to material differences and movement, leading to performance degradation of electronic components.
Innovation Solution
The integrated circuit package reduces stress by suspending the semiconductor die above its surface using connectors with specific spring constants and employing flexible substrates and adhesives with low modulus of elasticity, minimizing contact points and displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor die is directly mounted on the base substrate, then the electrical connection is stable, but stress is transferred from the package to the die causing performance degradation
Solution Approach 1:
The patent introduces an intermediary suspension structure between the base substrate and the semiconductor die. This suspension structure acts as a mediator that provides electrical connection while preventing direct mechanical stress transfer from the package to the die, thus resolving the contradiction between connection stability and stress reduction.
Solution Approach 2:
The patent segments the mounting structure into separate functional components: the base substrate, the suspension structure, and the die mounting structure. This segmentation allows each component to perform its specific function independently - the base substrate provides electrical connection, while the suspension structure provides mechanical isolation, thereby reducing stress on the die while maintaining connection stability.
2Object-affected harmful factors
If the semiconductor die is suspended above the base substrate, then stress on the die is minimized, but the structural complexity increases
Solution Approach 1:
The suspension structure is designed to perform multiple functions simultaneously: it provides mechanical suspension to minimize stress, establishes electrical connections between the die and base substrate, and maintains structural integrity. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in structural complexity while achieving stress minimization.
3Strength
If rigid materials are used in the package, then the package provides structural support, but stress is transferred to the semiconductor die during package movement
Solution Approach 1:
The patent changes the mechanical parameters of the package materials and structures. The suspension structure uses materials and designs with appropriate flexibility parameters that allow it to absorb movement-induced stress while maintaining structural support. This parameter optimization enables the package to provide necessary strength without transferring harmful stress to the semiconductor die during movement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes stress on the semiconductor die, enhancing the performance and reliability of electronic components by reducing mechanical contact and absorption of stress-induced movements.
Implementation Method 1
adhesive layer having a low modulus of elasticity
Data Source
AI summary
An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.