IC Package Digital Twin for Precise Non-Destructive Decapsulation
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Solution Overview
Problem
Current physical inspection methods for ICs, such as X-ray CT and X-ray CL imaging, struggle with accurately capturing structural data in all three dimensions, leading to inefficiencies and potential damage during packaging removal, especially with advanced 2.5D and 3D packages.
Innovation Solution
A hybrid metrology approach combining THz-TDS imaging and X-ray CT imaging to generate an ultra-high-resolution digital twin model of IC samples, enabling non-destructive material removal and automated sample preparation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high-resolution X-ray CT imaging is used to capture IC packaging structure, then measurement precision is improved, but time consumption increases significantly
Solution Approach 1:
The imaging process is divided into two segments: low-resolution X-ray CT for rapid overview and high-resolution X-ray CL for detailed characterization. This segmentation allows the system to achieve high measurement precision for packaging structure while minimizing time consumption by only applying high-resolution imaging to critical regions identified in the low-resolution scan.
Solution Approach 2:
The patent transitions from 3D volumetric imaging (X-ray CT) to 2D cross-sectional imaging (X-ray CL). This dimensional change enables high spatial resolution characterization of packaging structures without the time penalty of high-resolution 3D CT, as CL only images specific cross-sections rather than the entire volume.
2Productivity
If automated material removal is performed without accurate 3D structural data, then productivity is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent performs preliminary hybrid imaging (X-ray CL + CT) to create an accurate 3D digital twin model of the IC packaging structure before material removal begins. This preliminary action provides the automated material removal system with precise structural data, enabling high manufacturing precision while maintaining productivity through automation. The digital twin serves as a guide for the entire material removal process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the efficiency and accuracy of IC sample preparation for physical inspection by providing high spatial resolution thickness and geometry information, reducing time and operator input, and ensuring the integrity of regions of interest.
Implementation Method 1
non-destructive THz-TDS imaging
Implementation Method 2
X-ray CT imaging
Data Source
AI summary
Various embodiments are directed to analysis of three-dimensional structure of an integrated circuit (IC) sample in order to enable sample preparation for physical inspection and hardware assurance. Specifically, various embodiments provide a structural analysis framework that enables high-quality sample preparation, including careful material removal of IC packaging material without damaging internal components of the IC sample. In various embodiments, the structural analysis framework involves receiving a digital twin model of an IC sample, and the digital twin model may be generated using X-ray CT imaging. Then, various regions of interest of the IC sample may be identified and selected via the digital twin model. The structural analysis framework further includes performing THz-TDS to collect ultra-high-resolution thickness information at the regions of interest. Both the digital twin model and the ultra-high-resolution thickness information may then be used to guide material removal of the IC sample.