IC Package Assembly Using Direct Pad and Dielectric Contact

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Solution Overview

Problem

Conventional approaches for forming and handling integrated circuit (IC) substrates face challenges due to their small size and high density of connections, making it difficult to achieve a compact and reliable IC substrate-type package.

Innovation Solution

A package is created by connecting an integrated circuit substrate with an exposed substrate pad and dielectric to an electronic component with an exposed component pad and dielectric, achieving direct physical contact between both pads and dielectrics for a robust and compact connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional approaches are used for forming and handling IC substrates, then mechanical robustness and electrical reliability can be achieved, but the package size and connection spacing increase

Engineering Contradiction:

Improvepackage sizeVSAvoidconnection spacing

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent transitions from conventional planar connections to three-dimensional stacked connections. Multiple IC substrates are vertically stacked with direct pad-to-pad contacts between layers, enabling compact packaging while maintaining reliable electrical connections through the vertical dimension rather than expanding horizontally

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested structure where multiple IC substrates are stacked one on top of another, with each substrate containing circuits and pads that directly contact corresponding pads on adjacent substrates. This nesting approach maximizes space utilization and reduces overall package volume while maintaining connection integrity

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If the number of components and connections on IC substrates increases, then product functionality improves, but assembly complexity and handling difficulty increase

Engineering Contradiction:

Improveproduct functionalityVSAvoidassembly complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges multiple IC substrates into a single stacked assembly where each substrate contributes specific functional circuits. By combining multiple functional substrates vertically with direct pad contacts, the system achieves enhanced product functionality while the modular stacked structure simplifies assembly compared to managing numerous separate components

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent segments the overall system into multiple independent IC substrates, each containing specific circuits and pads. This segmentation allows each substrate to be manufactured and prepared separately with optimized functionality, then assembled into a compact stack, reducing overall assembly complexity while maintaining high functionality

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20250062261A1Package with IC substrate and electronic component connected with direct physical contact

Publication Date: 2025.02.20 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

AI summary

A package comprising an integrated circuit substrate having an exposed substrate pad and having an exposed substrate dielectric, and an electronic component having an integrated circuit, having an exposed component pad and having an exposed component dielectric, wherein the integrated circuit substrate is connected with the electronic component so that there is a direct physical contact between the substrate pad and the component pad and so that there is a direct physical contact between the substrate dielectric and the component dielectric.