IC Package with Discrete Components on Exposed Side
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Solution Overview
Problem
Existing integrated circuit packages require additional discrete components like quartz crystals and surface acoustic wave filters to be mounted on printed circuit boards, contributing significantly to the overall footprint and not fully utilizing the potential of through-silicon-vias for reduced footprint.
Innovation Solution
Mounting additional passive components such as quartz filters, surface acoustic devices, resistors, and capacitors on the front or backside of the topmost integrated circuit using conductive vias and a redistribution layer, which establishes connections between these components and the integrated circuit, allowing for a three-dimensional structure that reduces the overall footprint and improves component matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional discrete components are mounted on the printed circuit board, then the integrated circuit package can include all necessary components, but the overall footprint of the device increases significantly
Solution Approach 1:
The patent transitions from a two-dimensional layout where all components are mounted on the PCB surface to a three-dimensional structure by mounting additional passive components directly on the top surface of the integrated circuit chip itself. This vertical integration allows components to be stacked in multiple layers, with through-silicon vias providing inter-layer connections, thereby dramatically reducing the horizontal footprint while maintaining full component functionality
Solution Approach 2:
The patent implements nesting by placing passive components (such as capacitors, resistors, and inductors) directly on the chip surface, effectively nesting additional functional elements within the existing integrated circuit package volume. This allows the passive components to occupy space that would otherwise be unused, creating a compact hierarchical structure where multiple components coexist in a reduced footprint
2Area of stationary object
If through-silicon-vias are used to connect stacked chips, then the footprint is reduced, but additional discrete components still need to be mounted on the PCB
Solution Approach 1:
The patent makes the integrated circuit chip surface serve multiple functions: it acts as both the functional circuit substrate and as a mounting platform for additional passive components. The chip surface becomes a universal platform that can accommodate both active integrated circuit elements and passive discrete components, eliminating the need for a separate PCB mounting area and achieving both footprint reduction and complete component integration
3Area of stationary object
If components are mounted on the chip surface, then the footprint is reduced and component matching is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent performs preliminary actions by pre-positioning passive components on the chip surface during the chip fabrication process itself, before the chip is packaged or mounted on the PCB. Through-silicon vias are formed and conductive traces are established in advance, allowing subsequent component interconnections to be made more easily. This preliminary preparation of the chip surface as a ready-to-mount platform simplifies the overall manufacturing workflow despite the added complexity of surface mounting
Data Source
AI summary
An integrated circuit package has a host integrated circuit with an active front side that is surface-mounted on a support and an inactive back side. Conductive vias extend through the integrated circuit between the front and back sides. A redistribution layer on the back side of the host integrated circuit provides conductive traces and contact pads. The traces of the redistribution layer establish connection between the conductive vias and the contact pads. At least one additional component is surface-mounted on the back side of the host integrated circuit by electrical connection to the contact pads of the redistribution layer to provide a compact three-dimensional structure. In an alternative embodiment, the additional components can be mounted on the active side.