Non-leaded IC Package with Dual-Row Terminals
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Solution Overview
Problem
Modern consumer electronics require increased integrated circuit density within shrinking physical spaces, leading to higher input and output pin counts that congest printed circuit boards and increase manufacturing complexity, while existing solutions fail to adequately address cost reduction and space efficiency.
Innovation Solution
A non-leaded integrated circuit package system featuring a die paddle with dual rows of terminals and selectively fused extensions between the die paddle and inner terminal pads, providing additional ground bonding sites and reducing electrical interconnect density to alleviate congestion and improve manufacturing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If integrated circuit content increases in a package, then more functions are provided, but input and output density increases causing printed circuit board congestion and design complexity
Solution Approach 1:
The patent transitions from a traditional single-row terminal arrangement to a dual-row terminal arrangement on the lead frame. This dimensional change in terminal layout allows for higher input and output pin counts without increasing the footprint area, thereby reducing printed circuit board congestion and design complexity while maintaining enhanced integrated circuit functionality
2Adaptability or versatility
If integrated circuit content increases in a package, then more functions are provided, but physical space requirements increase
Solution Approach 1:
The patent utilizes a dual-row terminal configuration that optimizes space utilization within the package footprint. By arranging terminals in two rows rather than one, the design accommodates higher pin counts without proportionally increasing the package area, thus providing more functions within constrained physical space
Solution Approach 2:
The lead frame structure serves multiple functions: it provides mechanical support, electrical connections, and thermal management pathways. The dual-row terminal arrangement simultaneously achieves high pin count and compact footprint, making the package structure universally applicable to various integrated circuit density requirements
3Adaptability or versatility
If input and output density increases, then more functions are provided, but manufacturing complexity increases
Solution Approach 1:
The dual-row terminal layout on the lead frame enables higher input and output density while maintaining manufacturability. This dimensional reorganization of terminals allows standard manufacturing processes to accommodate increased pin counts without proportionally increasing process complexity or difficulty
Data Source
AI summary
A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including outer terminal pads and inner terminal pads, and selectively fusing an extension between the die paddle and instances of the inner terminal pads.