IC Package Structure With Floating Dummy Posts for Seed Residue Isolation
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Solution Overview
Problem
The semiconductor industry faces challenges in scaling down integrated circuits (ICs) due to increased complexities in processing and manufacturing, which requires advancements in IC fabrication techniques.
Innovation Solution
The manufacturing process involves forming conductive posts on contact pads and dummy posts on testing pads within the IC, with the dummy posts being electrically floating to prevent interference with the functional components, thereby addressing issues related to seed layer residues and ensuring device performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dummy posts are formed on testing pads during the same process as conductive posts on contact pads, then manufacturing efficiency is improved, but seed layer residues may contaminate functional areas and worsen device performance
Solution Approach 1:
The patent segments the dummy posts and conductive posts into spatially separated groups located in different regions of the semiconductor substrate. Dummy posts are positioned in first regions while conductive posts are positioned in second regions, preventing mixing of seed layer residues and maintaining functional integrity.
Solution Approach 2:
The patent extracts the dummy posts from the functional circuit areas and places them in separate dedicated regions. This extraction eliminates the risk of seed layer residues from dummy post formation contaminating the functional areas where conductive posts are located.
2Reliability
If dummy posts are formed to prevent interference with functional components, then device performance is maintained, but the complexity of the manufacturing process increases
Solution Approach 1:
The patent merges the formation of dummy posts and conductive posts into a single integrated process sequence. Both types of posts are formed simultaneously in the same manufacturing step, using the same seed layer deposition and electroplating processes, thereby avoiding additional process complexity while maintaining device performance.
Solution Approach 2:
The patent creates a universal manufacturing process that handles both dummy posts and conductive posts through the same fabrication steps. The process is designed to accommodate multiple post types without requiring separate dedicated processes, reducing overall process complexity.
Data Source
AI summary
A package structure includes an integrated circuit die and an encapsulant laterally encapsulating the integrated circuit die. The integrated circuit die includes a semiconductor substrate, an interconnection structure, a testing pad, a dummy post, a conductive post, and a protection layer. The interconnection structure is disposed on the semiconductor substrate. The testing pad is disposed on the interconnection structure. The dummy post is disposed on the testing pad. The conductive post is aside the dummy post. The protection layer is disposed between the conductive post and the dummy post.