IC Package with Embedded Interconnects for Heat Dissipation
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Solution Overview
Problem
The challenge lies in developing a three-dimensional integrated circuit assembly that enables efficient and cost-effective assembly and electrical connection of vertically stacked integrated circuits, while also providing effective heat dissipation, as existing methods are labor-intensive and costly, and struggle with limited input/output connections due to the large number of connecting pads.
Innovation Solution
The solution involves a substrate with interconnects mounted on one surface, integrated circuit dies attached to the substrate, and the interconnects and dies embedded within an encapsulant, with solder balls attached to the opposite surface, allowing for singulation into multiple packages, which reduces package size and enhances connectivity and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vertically stacked integrated circuits are assembled using conventional methods with special carriers and wire leads, then electrical connection between stacked packages is achieved, but the assembly process becomes labor-intensive and costly
Solution Approach 1:
The patent merges the interconnect structure with the package substrate by forming interconnects that extend from the substrate surface and are embedded in the encapsulant. This integration eliminates the need for separate wire leads and special carriers, reducing assembly complexity while maintaining electrical connectivity between stacked packages.
Solution Approach 2:
The interconnect structure serves multiple functions simultaneously: it provides electrical connection between packages, acts as a structural support element, and enables heat dissipation pathways. This multi-functionality reduces the need for separate components, simplifying the assembly process.
2Stability of the object's composition
If vertically stacked integrated circuits are assembled using conventional methods with peripheral frames, then structural support is provided, but the assembly complexity and cost increase
Solution Approach 1:
The patent combines the structural support function with the package substrate and encapsulant structure. The substrate provides the base structural support, while the encapsulant embedding the interconnects provides additional mechanical stability, eliminating the need for separate peripheral frames.
Solution Approach 2:
The patent extracts and eliminates the peripheral frame component from the assembly structure. By redistributing the structural support functions to the substrate and encapsulant, the design removes this unnecessary element, reducing assembly complexity.
3Volume of moving object
If more integrated circuits are stacked vertically to reduce package size, then space is saved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent implements localized heat dissipation pathways by embedding interconnects within the encapsulant that extend from the substrate surface. These interconnects create thermal conduits that conduct heat away from the stacked packages to the substrate, providing targeted heat management where needed.
Solution Approach 2:
The interconnects embedded in the encapsulant serve as thermal intermediaries, transferring heat from the integrated circuits through the encapsulant to the substrate. This intermediary pathway enables effective heat dissipation in compact vertical stack configurations.
4Adaptability or versatility
If the number of input/output connections is increased to accommodate more connecting pads, then connectivity is improved, but the package footprint increases
Solution Approach 1:
The patent transitions from a two-dimensional layout where connections are distributed across the package periphery to a three-dimensional structure where interconnects extend vertically and are embedded in the encapsulant. This dimensional change allows multiple connections to be stacked vertically rather than spread horizontally, increasing connectivity without expanding the package footprint.
Data Source
AI summary
An integrated circuit package system is provided including providing a substrate having a first surface and second surface; mounting interconnects to the first surface; mounting integrated circuit dies to the first surface; embedding the interconnects and the integrated circuit die within an encapsulant on the substrate and leaving top portions of the interconnects exposed; attaching solder balls to the second surface; and singulating the substrate and the encapsulant into a plurality of integrated circuit packages.