IC Package Structure With RDL Protection and EMI Shielding

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Solution Overview

Problem

Conventional IC packaging methods fail to effectively protect the redistribution layer (RDL) structure and the chip from damage during assembly and from electromagnetic interference (EMI) during use.

Innovation Solution

The proposed IC package structure includes a chip, a redistribution layer (RDL) structure, a molding compound structure, and an electromagnetic interference (EMI) shielding structure. The molding compound layer is sequentially provided on the outer surfaces of the chip and the RDL structure, and the EMI shielding structure is applied on top of the molding compound layer to enhance structural protection and EMI shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the molding compound layer is provided before the RDL structure, then the manufacturing process is simplified, but the outer surfaces of the RDL structure are not effectively protected

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidprotection of RDL structure

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent applies preliminary action by providing the molding compound layer over the RDL structure after the RDL is formed, ensuring the RDL surfaces are protected before subsequent assembly processes. This sequence guarantees that the RDL structure is covered and protected by the molding compound, preventing damage during handling and assembly while maintaining manufacturing efficiency.

Inventive Principle:

Principle #10Preliminary action

2Device complexity

If no EMI protection structure is provided, then the device complexity is reduced, but the chip is susceptible to electromagnetic interference

Engineering Contradiction:

Improvestructure complexityVSAvoidelectromagnetic interference susceptibility

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent employs composite materials by integrating an EMI shielding layer made of conductive material within the molding compound structure. This EMI shielding layer is provided between the molding compound and the RDL structure, creating a composite packaging structure that provides electromagnetic interference protection while maintaining overall structural integrity and minimizing additional complexity.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If the RDL structure is exposed without molding compound coverage, then the manufacturing process is simpler, but the RDL structure is subjected to damage in subsequent assembling processes

Engineering Contradiction:

Improvepackaging process simplicityVSAvoidstructural protection

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent applies preliminary action by ensuring the molding compound layer is provided over the RDL structure after the RDL is formed and before subsequent assembly processes. This sequence guarantees that the RDL structure is covered and protected by the molding compound, preventing damage during handling and assembly while maintaining manufacturing efficiency.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12266616B2Integrated circuit package structure

Publication Date: 2025.04.01 UNIMICRON TECH CORP

AI summary

An integrated circuit (IC) package structure includes a chip, a redistribution layer (RDL) structure, a molding compound structure and an electromagnetic interference (EMI) shielding structure. The RDL structure is formed on the chip and electrically connected thereto. The molding compound layer is provided on outer surfaces of the chip and the RDL structure. The EMI shielding structure is provided on outer surfaces of the molding compound structure. The molding compound structure layer provided on outer surfaces of the chip and the RDL structure provide protection and reinforcement to multiple faces of the IC package structure; and the EMI shielding structure provided on outer surfaces of the molding compound structure provides EMI protection to multiple faces of the chip and the RDL structure.