Integrated Circuit Package with Partially Exposed Die Recess
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Solution Overview
Problem
Current multi-chip packages face challenges in achieving high integrated circuit density, reliability, and cost-effectiveness due to limitations in testing individual integrated circuits before assembly, potential damage during assembly, and contamination issues during encapsulation, leading to assembly defects and increased manufacturing costs.
Innovation Solution
A mountable integrated circuit package system where an integrated circuit die is partially exposed within a recess of the package encapsulation, connected via internal interconnects to a package carrier, allowing for flexible mounting and reduced substrate needs, thereby improving testing and assembly processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multi-chip packages are used with complete encapsulation, then protection and structural integrity are improved, but individual integrated circuit testing before assembly becomes impossible and assembly defects increase
Solution Approach 1:
The encapsulation is segmented to create a recess that exposes a portion of the integrated circuit die, allowing the die to be divided into two functional zones: the exposed bonding pads area for testing and mounting, and the encapsulated area for protection. This segmentation enables both testing access and structural protection simultaneously.
Solution Approach 2:
The recess is formed in the encapsulation before the integrated circuit die is mounted, allowing testing and quality verification to be performed on individual dies before they are assembled into the final multi-chip package. This preliminary testing action prevents assembly of defective components.
2Quantity of substance
If vertically stacked integrated circuits are used to increase density, then integrated circuit density is improved, but testing and failure mode identification become more difficult and substrate damage risk increases
Solution Approach 1:
The recess creates a horizontal testing interface on the vertical stack, allowing testing to occur at the bonding pad level rather than requiring disassembly of the vertical stack. This dimensional change in testing access maintains high density while enabling quality verification.
3Object-affected harmful factors
If complete encapsulation is used to protect integrated circuits, then protection is improved, but contamination during encapsulation process increases and manufacturing costs rise
Solution Approach 1:
Instead of complete encapsulation, only the necessary portions of the integrated circuit die are encapsulated—the recess exposes the bonding pads area. This partial encapsulation action reduces contamination risk during the encapsulation process while still providing protection for the circuit elements.
4Quantity of substance
If more integrated circuits are mounted on a single substrate to increase density, then integrated circuit density is improved, but substrate real estate limitations and assembly complexity increase
Solution Approach 1:
The recess structure serves multiple functions simultaneously: it provides testing access, defines the mounting interface for the die, enables quality verification, and maintains structural integrity. This multi-functionality reduces assembly complexity despite high density requirements.
Data Source
AI summary
A mountable integrated circuit package system includes: mounting an integrated circuit die over a package carrier; connecting a first internal interconnect between the integrated circuit die and the package carrier; and forming a package encapsulation over the package carrier and the first internal interconnect, with the integrated circuit die partially exposed within a recess of the package encapsulation.