IC Package with Exposed Interconnects and Shoulder Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current integrated circuit package systems face challenges in achieving low-cost manufacturing, improved yield, and reliability while maintaining miniaturization and performance, particularly in portable devices, where conventional packages are complex and costly, and multi-chip solutions have not fully addressed these needs.
Innovation Solution
A mountable integrated circuit package system is introduced, featuring an inner package with a first external interconnect having a shoulder, an intraconnect connecting a second external interconnect to the shoulder, and an outer encapsulation that partially exposes these interconnects on the top and bottom sides, allowing flexible routing of electrical connections and reducing the need for costly wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional package configurations with lead frames and wire bonds are used, then electrical connections can be established, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the lead frame and wire bond components from the package structure. Instead, it uses direct bonding of bonding pads on the semiconductor die to external interconnects that are integrated into the package substrate, thereby simplifying the package construction while maintaining reliable electrical connections.
Solution Approach 2:
The patent merges the functions of the lead frame, wire bonds, and external interconnects into a single integrated structure. The external interconnects are directly formed on the package substrate and bonded to the die, combining multiple components into one unified system that reduces complexity.
2Quantity of substance
If multi-chip packages are used to increase density, then integrated circuit density improves, but manufacturing cost and complexity increase
Solution Approach 1:
The patent transitions from planar multi-chip packaging to a three-dimensional stacked configuration. Multiple semiconductor dies are stacked vertically and bonded to each other through the package substrate, utilizing the vertical dimension to achieve high density without increasing the package footprint or manufacturing complexity.
3Volume of moving object
If package size is reduced for miniaturization, then product size decreases, but external interconnect access becomes difficult
Solution Approach 1:
The package substrate serves multiple functions simultaneously: it provides mechanical support for the stacked dies, acts as an electrical interconnection network between layers, and provides external access points for electrical connections. This multi-functionality allows compact packaging while maintaining ease of external interconnect access through the substrate's external terminals.
Data Source
AI summary
The present invention provides a mountable integrated circuit package system comprising: providing an inner integrated circuit package including a first external interconnect having a shoulder; connecting an intraconnect between a second external interconnect and the shoulder; and forming an outer encapsulation over the inner integrated circuit package, the intraconnect, and partially exposing the first external interconnect on a top encapsulation side of the outer encapsulation and the second external interconnect on a bottom encapsulation side of the outer encapsulation.