IC Package Extended Corner Leads EMI Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The electronics industry faces challenges with conventional integrated circuit packaging technologies, including high costs, increased electromagnetic interference (EMI), thermal loads, and second-level assembly reliability stresses, particularly in portable electronics where cost-effective solutions for EMI shielding are lacking.
Innovation Solution
The proposed integrated circuit package system includes a die pad with a tiebar at a corner, connected leads, and an encapsulation with extended leads beyond its edge, allowing for optional EMI shielding integration, reducing material and process costs while maintaining versatility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging technologies are used to protect integrated circuits, then protection from environmental factors is achieved, but cost increases and EMI shielding capability is insufficient
Solution Approach 1:
The patent implements EMI shielding by nesting a conductive shield within the encapsulation structure. The shield is positioned inside the molded compound package, creating a nested configuration where the shield is contained within the protective encapsulation. This nested arrangement provides EMI protection while maintaining the environmental protection function of the encapsulation, resolving the contradiction between protection reliability and EMI shielding capability.
Solution Approach 2:
The patent introduces an intermediary EMI shield structure that mediates between the integrated circuit die and the external environment. The shield acts as an intermediary layer that blocks EMI from reaching the sensitive circuitry while allowing the encapsulation to continue providing environmental protection. This intermediary element resolves the contradiction by adding EMI shielding functionality without compromising the existing protection mechanisms.
2Object-affected harmful factors
If bulky metalized enclosures are used for EMI shielding, then EMI protection is improved, but device size and manufacturing cost increase
Solution Approach 1:
The patent embeds the EMI shield within the encapsulation volume rather than using an external bulky enclosure. The shield is nested inside the molded compound package, utilizing the existing internal space. This nested configuration provides effective EMI shielding while maintaining a compact device size, directly resolving the contradiction between EMI protection and device volume.
Solution Approach 2:
The patent merges the EMI shielding function with the existing encapsulation structure. The shield is integrated into the package design and combined with the molded compound housing, creating a unified structure that provides both environmental protection and EMI shielding. This merging eliminates the need for separate bulky enclosures, resolving the contradiction between shielding effectiveness and device size.
3Ease of manufacture
If conventional packaging structures are used, then manufacturing simplicity is maintained, but EMI shielding capability and versatility are insufficient
Solution Approach 1:
The patent creates a universal package structure that can accommodate both shielded and non-shielded applications. The encapsulation design with integrated tiebars and lead configurations can be used with or without an EMI shield, allowing the same basic structure to serve multiple functions. This multi-functionality resolves the contradiction by maintaining manufacturing simplicity while providing the option for EMI shielding when needed.
Solution Approach 2:
The patent applies EMI shielding selectively based on the specific application requirements. The shield can be included or excluded depending on whether EMI protection is needed for that particular integrated circuit. This localized application of shielding capability allows manufacturers to maintain simplicity for non-sensitive applications while providing versatility for EMI-sensitive applications, resolving the contradiction between manufacturing ease and adaptability.
Data Source
AI summary
An integrated circuit package system including: forming a die pad, wherein the die pad has a tiebar at a corner; forming a lead wherein the lead is connected to the tiebar; connecting an integrated circuit die to the die pad; and forming an encapsulation, having an edge, over the integrated circuit die with the lead extending from and beyond the edge.