Integrated Circuit Package Faraday Shield Substrate Layers
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Solution Overview
Problem
Conventional Faraday cage structures in stacked packaging schemes, such as POP packaging, increase package size and complexity, making it difficult to incorporate both EMI-sensitive and EMI-generating ICs without significant size and cost penalties.
Innovation Solution
Incorporating shield layers into existing electronic substrates and using a polymer-comprising conductive epoxy to electrically couple these layers, forming a Faraday cage without additional structure, thus maintaining package size and reducing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional Faraday cage structures are used in stacked packaging schemes, then electromagnetic interference is reduced, but package size increases
Solution Approach 1:
The patent merges the Faraday cage structure with the existing package substrate by integrating conductive shielding layers directly into the substrate layers. This eliminates the need for separate Faraday cage components while maintaining EMI shielding effectiveness, thereby reducing package size.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support, electrical interconnection, and electromagnetic shielding. By making the substrate multi-functional, the patent eliminates the need for additional dedicated EMI shielding structures, thus maintaining compact package dimensions.
2Object-affected harmful factors
If conventional Faraday cage structures are used in stacked packaging schemes, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The patent combines the EMI shielding function with the existing substrate structure by integrating conductive layers into the substrate's layer stack. This merger reduces the total number of discrete components and assembly steps, thereby simplifying device complexity.
Solution Approach 2:
The substrate itself provides EMI shielding through its integrated conductive layers, eliminating the need for separate shielding components and their associated assembly processes. This self-service approach reduces overall package complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces electromagnetic interference without increasing package dimensions, allowing for the close placement of EMI-sensitive and EMI-generating ICs, preserving the size advantages of stacked packaging while minimizing cost and complexity.
Implementation Method 1
by incorporating shield layers into existing electronic substrates used for creating stackable packages and applying a polymer-comprising conductive epoxy to electrically contact the shield layers, a Faraday cage can be provided therebetween
Data Source
AI summary
A packaged integrated circuit (IC) (100) includes a first substrate (110) comprising a first plurality of layers and a first circuit coupling features (112) at an upper surface of the first substrate (110), the first plurality of layers including a first electromagnetic interference shielding layer (132). The packaged IC also includes a second substrate (106) having an upper surface attached to a lower surface of the first substrate (110) by an electrically conductive adhesive material (136). The second substrate (106) includes a second plurality of layers and a second circuit coupling feature (108) at a lower surface of the second substrate (106). The first plurality of layer includes a second EMI shielding layer (134). The packaged IC further includes a functional die (124) disposed between the first (110) and the second (106) substrates and functionally coupled to the first (112) and/or the second (108) circuit coupling features. In the packaged IC, the adhesive material (136) electrically couples the first (132) and the second (134) shielding layers.