Integrated Circuit Package with Glass Substrate Optical Channel
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Solution Overview
Problem
Conventional optical interconnects for high data transmission rates in computing and data center applications are costly, power-intensive, and difficult to manufacture, while existing integrated circuit packages face challenges in achieving high data transmission rates due to interference between electrical and optical channels.
Innovation Solution
The development of integrated circuit packages that incorporate a structured glass article with a glass substrate, optical channel, and redistribution layers, allowing for an integrated circuit chip to be positioned on the glass substrate in optical communication with the optical channel and in electrical continuity with the redistribution layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional optical interconnects are used to achieve high data transmission rates, then data transmission performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines optical and electrical interconnect functions into a single integrated circuit package. The optical channel and electrical traces are integrated within the same package structure, eliminating the need for separate optical interconnect assemblies and reducing overall device complexity while maintaining high data transmission rates
Solution Approach 2:
The glass substrate serves multiple functions simultaneously: it provides mechanical support for the integrated circuit chip, contains the optical channel for optical signal transmission, and provides a stable platform for electrical connections. This multi-functionality reduces the number of separate components needed
2Speed
If conventional optical interconnects are used to achieve high data transmission rates, then data transmission performance is improved, but manufacturing difficulty increases
Solution Approach 1:
The optical channel is fabricated as an integral part of the glass substrate using standard glass processing techniques. The optical channel is formed by creating a waveguide structure within the glass substrate, which can be done using conventional glass manufacturing and processing methods, thereby simplifying production
Solution Approach 2:
The optical channel is pre-formed within the glass substrate before the integrated circuit chip is mounted. This preliminary formation of the optical path allows for precise alignment and simplifies subsequent assembly steps, as the optical interface is already prepared in the substrate
3Adaptability or versatility
If electrical and optical channels are integrated in conventional packages, then connectivity is improved, but data transmission rates are limited due to interference
Solution Approach 1:
The package is segmented into distinct optical and electrical channels that are spatially separated within the glass substrate. The optical channel is formed as a separate waveguide structure, physically isolating optical signals from electrical traces and preventing electromagnetic interference, thereby enabling high-speed data transmission
Solution Approach 2:
The glass substrate acts as an intermediary medium that guides optical signals through a dedicated optical channel while electrical connections are routed through separate traces. This intermediary structure mediates between optical and electrical domains, allowing both to coexist without interference
Data Source
AI summary
Integrated circuit packages having electrical and optical connectivity and methods of making the same are disclosed herein. According to one embodiment, an integrated circuit package includes a glass substrate, an optical channel, and redistribution layers. The integrated circuit package further includes an integrated circuit chip positioned on the glass substrate and in optical communication with the optical channel and in electrical continuity with the redistribution layers.