Ferromagnetic IC Package Shielding With PCB Grounded Sidewalls
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Solution Overview
Problem
Integrated circuit (IC) packages face challenges with electromagnetic interference (EMI) noise radiation due to the lack of effective shielding, leading to performance issues and increased thermal resistance, which is exacerbated by the need for additional components like external cases and thermal interface materials (TIMs) that occupy space and increase manufacturing costs.
Innovation Solution
An IC package design featuring a ferromagnetic electromagnetic shield directly mounted on the chip and substrate, with sidewall portions grounded to the printed circuit board, eliminating the need for external shielding and TIMs, and utilizing internal TIMs for heat dissipation while preventing EMI noise radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional IC packages without integrated electromagnetic shielding are used, then manufacturing complexity is lower, but electromagnetic interference noise radiation increases and performance deteriorates
Solution Approach 1:
The electromagnetic shield is integrated directly into the IC package structure, merging the shielding function with the package lid. This eliminates the need for separate external shielding components while providing effective EMI protection, thus improving performance without proportionally increasing manufacturing complexity
Solution Approach 2:
The lid structure serves multiple functions: it provides mechanical protection, environmental sealing, and electromagnetic shielding. By making the lid multi-functional, the patent reduces the need for additional components and achieves EMI protection without significantly complicating the manufacturing process
2Object-affected harmful factors
If external cases and thermal interface materials are added for shielding and heat dissipation, then electromagnetic interference protection improves, but thermal resistance increases and space is consumed
Solution Approach 1:
The electromagnetic shield and thermal management functions are merged into a single integrated structure. The shield's bottom surface directly contacts the chip, eliminating the need for separate thermal interface materials and reducing thermal resistance while maintaining EMI protection
Solution Approach 2:
The patent removes the need for external cases and separate thermal interface materials by integrating both shielding and thermal management functions directly into the IC package structure, thus reducing space consumption and thermal resistance
3Object-affected harmful factors
If additional external shielding components are used, then electromagnetic interference shielding improves, but manufacturing costs increase
Solution Approach 1:
The electromagnetic shielding function is merged into the existing IC package lid, eliminating the need for separate external shielding components. This integration reduces part count, assembly steps, and manufacturing costs while maintaining effective EMI protection
Solution Approach 2:
The lid is designed to perform multiple functions including mechanical protection, environmental sealing, and electromagnetic shielding. This multi-functionality reduces the need for additional components and lowers overall manufacturing costs while providing comprehensive EMI protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces EMI noise radiation, decreases thermal resistance, and minimizes space and manufacturing costs by integrating shielding and thermal management within the IC package, allowing for more efficient heat dissipation and improved performance without additional components.
Implementation Method 1
the electromagnetic shield includes a ferromagnetic material and prevents an electromagnetic interference (EMI) noise from radiating through the IC package
Implementation Method 2
decreases thermal resistance, and minimizes space and manufacturing costs by integrating shielding and thermal management within the IC package, allowing for more efficient heat dissipation
Data Source
AI summary
Example implementations relate to an integrated circuit (IC) package, an electronic device having the IC package, and a method of assembling the IC package to a printed circuit board (PCB) of the electronic device. The IC package includes a substrate, a chip, and an electromagnetic shield. The chip is coupled to the substrate. The electromagnetic shield is coupled to the substrate such that the chip is enclosed between the substrate and the electromagnetic shield. The electromagnetic shield includes a ferromagnetic material. Further, the electromagnetic shield protrudes beyond the substrate and is electrically grounded to the PCB to prevent an electromagnetic interference (EMI) noise from radiating through the IC package.