IC Package Heat Dissipation Structure for Vapor Film and Wicking Limits
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving effective heat dissipation in integrated circuit packages due to limitations in surface area and wicking rates, which hinder the efficiency and capacity of heat dissipation, especially with the presence of boiling vapor films that obstruct cooling fluid contact.
Innovation Solution
A heat dissipation structure is introduced that includes macrostructures such as a heat spreading layer and pillars, along with microstructures like nanostructures over the pillars, to increase the surface area and wicking rate, allowing for enhanced heat dissipation by utilizing latent heat of cooling fluids and overcoming the limitations posed by boiling vapor films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a flat heat dissipation surface is used, then the device structure is simple, but the surface area for heat exchange is limited and wicking rate is insufficient
Solution Approach 1:
The patent transitions from a two-dimensional flat heat dissipation surface to a three-dimensional structured surface with macrostructures (pillars, protrusions) and microstructures (nanostructures). This dimensional expansion significantly increases the surface area available for heat exchange and cooling fluid contact, directly resolving the contradiction between surface area and structural complexity.
Solution Approach 2:
The patent employs porous or structured materials with controlled porosity to create macro and micro structures on the heat dissipation surface. These porous structures increase surface area while maintaining structural integrity, enabling enhanced heat exchange without excessive complexity.
2Reliability
If cooling fluid flows over a flat surface, then the system is simple, but boiling vapor films obstruct contact between cooling fluid and heat dissipation surface
Solution Approach 1:
By creating three-dimensional macrostructures and microstructures on the heat dissipation surface, the patent eliminates dead zones where vapor films can form. The structured surface ensures continuous cooling fluid contact with heat-generating regions, improving heat dissipation reliability while managing the associated structural complexity.
Solution Approach 2:
The patent applies different structural characteristics to different regions of the heat dissipation surface. Macrostructures are positioned in high heat flux areas to enhance local heat transfer, while microstructures are distributed to maintain uniform cooling fluid flow. This localized optimization improves overall heat dissipation efficiency without uniformly increasing complexity across the entire surface.
3Productivity
If the surface area is increased using macrostructures only, then heat exchange capacity improves, but wicking rate is still insufficient
Solution Approach 1:
The patent segments the heat dissipation surface into multiple hierarchical levels: macrostructures (pillars, protrusions) for overall heat distribution and exchange, and microstructures (nanostructures) for rapid wicking action. This segmentation allows each level to perform its specialized function, achieving both high heat dissipation capacity and fast wicking rate simultaneously.
Solution Approach 2:
The patent implements a nested structure where microstructures are positioned on or within macrostructures. The nanostructures are embedded in or attached to the surfaces of the larger pillars and protrusions, creating a multi-scale hierarchical architecture. This nesting enables the smaller structures to enhance the functional performance of the larger structures, combining high heat exchange capacity with rapid wicking speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed heat dissipation structure effectively improves the thermal conductivity and efficiency of integrated circuit packages, enabling them to handle high-performance integrated circuit devices by increasing the surface area for heat exchange and reinstating cooling fluid flow through capillary action.
Implementation Method 1
increasing the surface area for heat exchange
Implementation Method 2
reinstating cooling fluid flow through capillary action
Implementation Method 3
utilizing latent heat of cooling fluids
Data Source
AI summary
In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.