IC Package Heat Sink Structure for Thermal and Inductor Efficiency
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Solution Overview
Problem
The integrated circuit package can affect the operations of the inductor and the integrated circuit, particularly in terms of thermal management and magnetic field efficiency.
Innovation Solution
A packaged integrated circuit (IC) design that includes a package substrate with an inductor coupled to it, a heat sink with a higher thermal conductivity material, and the inductor and heat sink encapsulated with a magnetic material to enhance thermal management and magnetic field concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the inductor and integrated circuit are encapsulated in an integrated circuit package, then the footprint of the integrated circuit is reduced and interconnects are shortened, but thermal management is adversely affected
Solution Approach 1:
The patent combines the heat sink with the package substrate into a single integrated structure. The package substrate serves dual functions as both the mounting platform for the integrated circuit and as the heat dissipation structure. This merging eliminates the need for separate heat sink components while maintaining effective thermal management within the compact package.
Solution Approach 2:
The package substrate is designed to perform multiple functions simultaneously: it provides mechanical support for the integrated circuit, serves as an electrical interconnect platform, and acts as a heat sink for thermal management. This multi-functionality allows the single component to address both the footprint reduction requirement and the thermal management challenge.
2Area of stationary object
If the inductor and integrated circuit are encapsulated in an integrated circuit package, then the footprint is reduced, but magnetic field efficiency is adversely affected
Solution Approach 1:
The patent applies different material properties to different regions of the package substrate. The portion of the substrate underlying the inductor is designed with magnetic field permeability optimized for magnetic flux containment, while other regions maintain properties suitable for electrical interconnection and thermal dissipation. This local differentiation allows the substrate to support both the integrated circuit and inductor effectively without compromising magnetic field efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively removes heat from the integrated circuit, prevents overheating, and improves the operational efficiency of both the inductor and the integrated circuit by leveraging the high thermal conductivity and magnetic permeability of the materials used.
Implementation Method 1
A heat sink is coupled to the IC. The second material has a higher thermal conductivity than the first and third materials.
Implementation Method 2
A third material is on the first material and encapsulates the inductor and at least part of the heat sink. The second material has a higher thermal conductivity than the first and third materials.
Data Source
AI summary
A packaged integrated circuit (IC) includes a package substrate and an IC on the package substrate. A first material is on the package substrate and encapsulates the IC. An inductor is coupled to the package substrate. A heat sink includes a second material. The heat sink is coupled to the IC. A third material is on the first material and encapsulates the inductor and at least part of the heat sink. The second material has a higher thermal conductivity than the first and third materials.