IC Package Heat Spreader Layout for Lower Thermal Resistance
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently dissipating heat generated by high-power components, leading to increased thermal resistance and larger footprints, which affect the performance and packaging efficiency of integrated circuit (IC) chips.
Innovation Solution
The IC package design incorporates a heat spreader mounted on the die pad and extending between the edges of the molding, using a thermally conductive adhesive to minimize gaps and enhance thermal transfer, combined with a heat sink for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat spreader is added to improve heat dissipation, then thermal conductivity is improved, but device complexity increases
Solution Approach 1:
The heat spreader is integrated with the molding structure, merging the heat dissipation function with the protective packaging structure. This combination reduces the number of separate components while maintaining effective heat transfer from the die to the external environment.
Solution Approach 2:
The molding structure serves multiple functions: it provides mechanical protection for the semiconductor die, establishes electrical connections through integrated leads, and acts as a heat spreader when equipped with the heat dissipation structure. This multi-functionality improves heat dissipation without proportionally increasing device complexity.
2Reliability
If the heat spreader extends between edges of the molding, then thermal resistance is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The heat spreader is positioned and secured to the molding structure before the final packaging steps are completed. This preliminary positioning ensures proper thermal contact between the heat spreader, die, and molding, establishing optimal thermal pathways early in the manufacturing process while maintaining flexibility for subsequent assembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces thermal resistance and increases thermal conductivity, allowing for smaller footprints and improved heat dissipation, thereby enhancing the performance and packaging efficiency of IC packages.
Implementation Method 1
The heat spreader provides a second surface of the IC package... reduces thermal resistance and increases thermal conductivity
Data Source
AI summary
An integrated circuit (IC) package includes a molding having a first surface and a second surface, the first surface opposing the second surface. An interconnect is encased in the molding. The interconnect includes pads situated at a periphery of a side of the IC package. A portion of the pads are exposed at the first surface of the molding. A die pad is situated proximal to the second surface of the molding. The die pad has a first surface and a second surface, the first surface opposing the second surface, and the second surface is circumscribed by the second surface of the molding. A die is mounted on the first surface of the die pad. A heat spreader is mounted on the second surface of the molding and the second surface of the die pad. The heat spreader extends between edges of the second surface of the molding.