Clamshell IC Package Heatsink for PCB-Free Signal and Power Routing
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Solution Overview
Problem
The increasing demand for integrated circuits leads to issues such as insertion loss, reflections, cross-talk, high voltage drops, power loss, and thermal problems at the package-PCB boundary due to increased density and power requirements.
Innovation Solution
An integrated circuit package design that eliminates the need for a printed circuit board by using signal conductors on opposite surfaces of a substrate, with a heatsink that absorbs heat directly from the package, and power bars within the heatsink to deliver electrical power, reducing thermal and power-related issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If integrated circuit density is increased, then processing power and functionality are improved, but insertion loss and signal integrity issues worsen at the package-PCB boundary
Solution Approach 1:
The patent extracts the signal conductors from the traditional PCB routing path and integrates them directly into the package substrate. This eliminates the package-PCB boundary interface that causes insertion loss, while maintaining high-density signal routing capabilities through vertically stacked conductor layers within the package itself.
Solution Approach 2:
The patent transitions from planar PCB routing to three-dimensional stacked conductor layers within the package substrate. Signal conductors are arranged in multiple vertical layers with via connections, enabling high-density routing without increasing footprint and eliminating boundary-related losses by keeping all signaling within the package volume.
2Power
If power delivery is increased to meet demand, then performance is improved, but voltage drops and power loss in the PCB worsen
Solution Approach 1:
The patent segments the power delivery system into multiple independent power bars positioned at different locations within the heatsink. Each power bar can be independently optimized for its local power delivery needs, reducing current density and associated I²R losses compared to traditional single-path PCB power routing.
Solution Approach 2:
The heatsink serves as an intermediary structure that simultaneously provides thermal management and power delivery functions. Power bars are integrated within the heatsink body, creating a dual-function component that delivers power directly to the IC while dissipating heat, eliminating the separate PCB power delivery path that suffers from voltage drops.
3Productivity
If power and density are increased, then performance is improved, but thermal issues at the package-PCB boundary worsen
Solution Approach 1:
The patent merges the thermal management function and power delivery function into a single integrated heatsink structure. The heatsink simultaneously serves as the primary thermal dissipation path and as the carrier for power bars, eliminating the need for separate PCB-based power delivery that would otherwise contribute to thermal issues at the package boundary.
4Ease of manufacture
If traditional PCB routing is used, then ease of manufacture is maintained, but device complexity increases due to boundary interface issues
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical signaling, and thermal management interfaces. By integrating signal conductors, power delivery, and thermal pathways directly into the package substrate without requiring a separate PCB, the design eliminates boundary interface complexity while maintaining manufacturing feasibility through established semiconductor packaging processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces voltage drops, power losses, and thermal issues while minimizing insertion losses by eliminating the need for a printed circuit board and effectively managing heat through a clamshell-style heatsink, enhancing the performance and efficiency of integrated circuit packages.
Implementation Method 1
The heatsink absorbs heat from the integrated circuit package
Data Source
AI summary
An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.