IC Package Support Substrate for Heat Dissipation and Die Height Matching

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Solution Overview

Problem

The semiconductor industry faces challenges in achieving efficient heat dissipation and accommodating varying memory device thicknesses in integrated circuit packages due to the limitations of existing packaging techniques.

Innovation Solution

The integration of a support substrate of varying thickness over logic and memory devices, allowing for hybrid bonding and thermal solutions like heat spreaders, which enhances heat dissipation efficiency and accommodates different memory device thicknesses.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional packaging techniques are used, then manufacturing simplicity is maintained, but heat dissipation efficiency deteriorates and adaptability to varying memory device thicknesses is limited

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidpackaging structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The packaging structure is segmented into multiple functional layers: a support substrate providing mechanical foundation, a thermal interface layer for heat dissipation, and a top layer accommodating memory devices of varying thicknesses. This segmentation allows each layer to be optimized independently for its specific function, improving overall heat dissipation efficiency without requiring complete redesign of the entire package.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support substrate is designed with variable thickness parameters - thicker regions positioned to provide enhanced thermal conduction paths and mechanical support, while thinner regions accommodate the memory devices. This parameter variation enables the structure to adapt to different memory device thicknesses while maintaining effective heat dissipation pathways.

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If uniform thickness packaging is used, then manufacturing precision is simplified, but adaptability to diverse memory device thicknesses deteriorates

Engineering Contradiction:

Improveaccommodation of varying memory device thicknessesVSAvoidsurface evenness for thermal solutions

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The support substrate employs an asymmetric thickness distribution, with varying thickness zones strategically positioned to match the thermal and mechanical requirements of different memory device locations. This asymmetric design provides adaptability to diverse memory device thicknesses while the overall structure maintains sufficient surface evenness through careful geometric design.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

A thermal interface layer or underfill material acts as an intermediary between the variable-thickness support substrate and the memory devices. This intermediary compensates for thickness variations, providing a sufficiently even surface for thermal contact while allowing the underlying substrate to have the asymmetric thickness profile needed for adaptability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach provides improved heat dissipation and reliability by creating a more even surface for thermal solutions and accommodating diverse memory device thicknesses, enhancing the performance and durability of integrated circuit packages.

Implementation Method 1

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240395751A1Integrated circuit package and method of forming thereof

Publication Date: 2024.11.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package includes a redistribution structure, a first device and a second device attached to the redistribution structure, the first device including: a first die, a support substrate bonded to a first surface of the first die, and a second die bonded to a second surface of the first die opposite the first surface, where a total height of the first die and the second die is less than a first height of the second device, and where a top surface of the substrate is at least as high as a top surface of the second device, and an encapsulant over the redistribution structure and surrounding the first device and the second device.