IC Package Substrate with Heterogeneous Bonding for Dense Integration
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Solution Overview
Problem
Integrated circuit packages face integration challenges due to differences in materials and dimensions of package components, leading to increased complexity and the need for creative integration solutions as package component density requirements rise.
Innovation Solution
A heterogeneous integration scheme is employed, using underbump metallization joints and direct bonding methods to attach semiconductor package components to an interposer substrate, allowing for multiple bonding methods such as hybrid bonding and under-bump metallization, facilitating the integration of various semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple bonding methods are used to integrate diverse semiconductor devices, then adaptability and integration flexibility are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent implements a universal interposer substrate that supports multiple bonding methodologies (direct bonding, underbump metallization, hybrid bonding) through integrated processing steps. The interposer is designed with universal features including bonding pads, through-vias, and surface preparations that can accommodate different bonding techniques, allowing a single platform to integrate diverse semiconductor devices with varying material compositions and dimensional specifications
Solution Approach 2:
The interposer substrate serves as an intermediary component between different semiconductor devices, providing a common interface that mediates the integration of devices with different materials and dimensions. The interposer includes bonding pads and through-vias that act as intermediate connection points, enabling heterogeneous devices to be bonded together through standardized processes while managing the complexity of direct device-to-device integration
2Quantity of substance
If package component density is increased to meet higher integration requirements, then functionality and integration level are improved, but integration issues and manufacturing complexity worsen
Solution Approach 1:
The patent utilizes three-dimensional stacking arrangements where semiconductor devices are bonded in vertical layers on top of the interposer substrate. This vertical dimensionality allows high component density to be achieved without proportionally increasing lateral manufacturing complexity, as devices are integrated through stacked layers rather than lateral arrangements, enabling higher integration levels while managing fabrication complexity
3Adaptability or versatility
If heterogeneous materials with different dimensions are integrated, then functionality and device variety are improved, but material compatibility and integration reliability worsen
Solution Approach 1:
The interposer substrate is designed with locally optimized features for different bonding regions, including varying pad geometries, material compositions, and surface treatments in different areas to match the specific requirements of each semiconductor device being integrated. This local customization of bonding interfaces ensures reliable integration of heterogeneous materials with different dimensional specifications while maintaining overall system reliability
Data Source
AI summary
Integrated circuit package structures and methods of forming integrated circuit package structures are discussed. An integrated circuit package structure, in accordance with some embodiments, includes an integrated circuit package substrate with a heterogeneous bonding scheme that includes conductive pillars for bonding semiconductor devices to as well as a region including conductive connectors embedded in a dielectric for bonding additional semiconductor devices.