IC Package Lid Assembly With Retaining Structure for Indium Overflow

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Solution Overview

Problem

The semiconductor industry faces challenges in creating smaller and more reliable packaging techniques for semiconductor dies as the demand for miniaturization increases, with issues such as metal overflow during heat dissipation leading to short circuits and void formation in heat dissipation structures.

Innovation Solution

The integration of a retaining structure adjacent to the package components, combined with a heat dissipation structure containing indium, which is contained during heat clamping and reflow processes to prevent metal overflow and void formation, ensuring reliable electrical connections and improved package performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If heat dissipation structures containing indium are used during heat clamping and reflow processes, then thermal management and electrical connections are improved, but metal overflow occurs leading to short circuits and void formation

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidmetal overflow causing short circuits

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

A retaining structure is formed on the package substrate before attaching the heat dissipation structure. This retaining structure creates a containment region that prevents metal overflow during subsequent heat clamping and reflow processes, while still allowing the indium to flow and form electrical connections between the package component and substrate

Inventive Principle:

Principle #10Preliminary action

2Reliability

If heat dissipation structures containing indium are used during heat clamping and reflow processes, then thermal management and electrical connections are improved, but voids form in the heat dissipation structure

Engineering Contradiction:

Improveheat dissipation structure integrityVSAvoidvoid formation in heat dissipation structure

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The retaining structure is formed in advance to define a containment region that guides the indium flow during heat clamping and reflow. This prevents the metal from forming voids within the heat dissipation structure while ensuring complete coverage and intimate contact between the package component and substrate

Inventive Principle:

Principle #10Preliminary action

3Volume of moving object

If smaller packaging techniques are implemented to meet miniaturization demands, then device size is reduced, but packaging complexity and reliability challenges increase

Engineering Contradiction:

Improvepackage sizeVSAvoidpackaging technique complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The package structure is segmented into distinct functional regions: a package component region, a retaining structure region, and a heat dissipation structure region. This segmentation allows each component to be optimized independently while working together in the compact package design

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The retaining structure is placed locally at specific positions on the package substrate where metal overflow is most likely to occur. This localized approach provides containment precisely where needed without adding unnecessary complexity to the entire package structure

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the reliability and performance of integrated circuit packages by preventing short circuits and voids in the heat dissipation structure, thereby improving the overall functionality and durability of the semiconductor devices.

Implementation Method 1

perform a bonding process to bond the thermal interface material to the package component and the lid, the bonding process being performed at a temperature greater than the melting point of the thermal interface material

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 2

heat clamping and reflow processes to attach the lid and/or the heat dissipation structure

Methodology Applied

Scientific EffectReflow:

Implementation Method 3

heat dissipation structure which is contained during heat clamping and reflow processes

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250309029A1Integrated circuit packages and methods of forming the same

Publication Date: 2025.10.02 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An embodiment is a device including a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a first side of the package component. The device also includes a metal layer on a second side of the package component, the second side being opposite the first side. The device also includes a thermal interface material on the metal layer. The device also includes a lid on the thermal interface material. The device also includes a retaining structure on sidewalls of the package component and the thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.