3D IC Package Interposer Layout for Heat and Connectivity
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving efficient heat dissipation and electrical connectivity in integrated circuit packages, particularly as feature sizes decrease and packaging techniques become more complex.
Innovation Solution
The solution involves forming integrated circuit packages with integrated circuit devices stacked and laterally adjacent to each other, using interposer and carrier redistribution structures for efficient electrical connectivity. External connectors are formed through the interposer redistribution structure to facilitate heat dissipation and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive features of the interposer redistribution structure are used for electrical connectivity, then electrical connectivity between integrated circuit dies is improved, but heat dissipation is worsened due to direct electrical connection
Solution Approach 1:
The conductive features are segmented into discrete pads rather than continuous traces, allowing selective electrical connection while creating thermal breaks. The external connectors are also segmented and positioned to provide thermal pathways independent of the electrical connection paths through the interposer.
Solution Approach 2:
The interposer redistribution structure serves as an intermediary that decouples electrical and thermal pathways. Electrical connections are made through conductive pads and external connectors, while thermal management is achieved through separate mechanisms including the carrier substrate and packaging structure, preventing direct thermal coupling through the electrical interconnects.
2Reliability
If integrated circuit devices are stacked and laterally adjacent to increase connectivity, then electrical connectivity and packaging density are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The interposer redistribution structure performs multiple functions simultaneously: it provides electrical redistribution, mechanical support, and thermal management. The carrier substrate similarly serves multiple roles including structural support, electrical connection, and thermal dissipation, reducing the need for separate dedicated components and simplifying the overall packaging architecture.
Solution Approach 2:
The packaging architecture transitions from two-dimensional lateral arrangement to three-dimensional stacking with lateral adjacency. Dies are arranged in multiple layers vertically stacked with some dies positioned laterally adjacent to others, utilizing the vertical dimension to increase connectivity while maintaining manageable lateral footprints through the interposer structure.
3Quantity of substance
If feature sizes are reduced to increase integration density, then integration density is improved, but heat dissipation becomes more difficult
Solution Approach 1:
Heat dissipation pathways are extended into the vertical dimension through the multi-layer die stacking and the thickness of the carrier substrate and interposer. Thermal pathways conduct heat from upper dies through lower dies and the carrier substrate to the packaging structure, providing additional thermal management capacity beyond the lateral plane where integration density increases.
Data Source
AI summary
A method includes attaching a first die and a second die to a first wafer, the first wafer comprising: a first carrier substrate; and a first interconnect structure comprising first dielectric layers and first conductive features embedded in the first dielectric layers; attaching a third die to the first die and a fourth die to the second die; attaching a second wafer to the third die and the fourth die, the second wafer comprising: a second carrier substrate; and a second interconnect structure comprising second dielectric layers and second conductive features embedded in the second dielectric layers; removing the first carrier substrate; patterning the first dielectric layers to expose conductive features of the first die and the second die; and forming external connectors through the first dielectric layers, the external connectors being electrically connected to corresponding ones of the conductive features of the first die and the second die.