IC Package Interposer Stacking for Density

The patent transitions from horizontal planar packaging to vertical three-dimensional stacking by introducing interposer structures that enable multiple die to be stacked vertically. The interposer acts as a redistribution layer that routes signals between stacked die, allowing circuitry density to increase in the vertical dimension rather than requiring expanded horizontal footprint.

The patent implements a nested structure where multiple die are stacked within a single package cavity, with each die nested on top of the previous one. The interposer structures are nested between the die layers, creating a compact vertical arrangement that maximizes circuitry density within the constrained horizontal footprint.

The patent introduces interposer structures as intermediary elements between stacked die. These interposers contain redistribution layers that act as mediators, routing and redistributing electrical signals between the stacked die. This intermediary structure simplifies the electrical interconnect complexity by providing organized signal pathways rather than requiring direct complex routing between all die layers.

The patent segments the electrical interconnection function into multiple distributed redistribution layers within the interposer structures. Rather than requiring a single complex interconnect system, the segmentation of interconnection functions across multiple interposer layers simplifies the overall electrical interconnect complexity by breaking down the routing task into manageable segments.