IC Package Interposer Layout for High-Density I/O Fan-Out
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing density of input/output (I/O) pads on integrated circuit dies, resulting from their miniaturization and functional integration, poses challenges in die packaging due to reduced available area, making it difficult to accommodate the growing number of I/O pads.
Innovation Solution
The integration of fan-out interposers on a system-on-wafer assembly, extending beyond the wafer edges, allows for the redistribution of I/O pads to a larger area, enabling the use of external connectors that extend beyond the wafer's outermost extent, thereby increasing the surface area for external connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If integrated circuit dies are miniaturized and more functions are integrated, then the functional capability increases, but the available area for I/O pads decreases
Solution Approach 1:
The patent extends the I/O connection area from the two-dimensional wafer surface into the third dimension by having interposers and external connectors extend beyond the wafer edges. This dimensional extension provides additional space for I/O pads without increasing the wafer area, resolving the contradiction between functional integration and available I/O pad area.
2Quantity of substance
If the density of I/O pads increases, then the number of connections increases, but the difficulty of die packaging increases
Solution Approach 1:
The patent divides the I/O connection function across multiple components: the wafer, interposers, and external connectors. By segmenting the connection architecture and extending it beyond the wafer boundaries, the packaging complexity is distributed and managed more effectively, allowing higher I/O pad density without proportionally increasing packaging difficulty.
3Area of stationary object
If fan-out interposers are integrated on system-on-wafer assembly extending beyond wafer edges, then the I/O pads can be redistributed to a larger area, but the package component boundaries are exceeded
Solution Approach 1:
The patent deliberately extends the package component shape beyond the traditional wafer boundaries by having interposers and external connectors protrude from the wafer edges. This intentional shape extension enables larger area for I/O pad redistribution while accepting and designing around the modified package boundaries, rather than treating it as a worsening condition.
Data Source
AI summary
In an embodiment, a device includes: a package component including: a first integrated circuit die; an encapsulant at least partially surrounding the first integrated circuit die; a redistribution structure on the encapsulant, the redistribution structure physically and electrically coupling the first integrated circuit die; a first module socket attached to the redistribution structure; an interposer attached to the redistribution structure adjacent the first module socket, the outermost extent of the interposer extending beyond the outermost extent of the redistribution structure; and an external connector attached to the interposer.