IC Package Isolation Holes for High Density I/O
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Solution Overview
Problem
Conventional semiconductor package solutions face challenges in achieving high density and high count I/O while maintaining low manufacturing costs and improved reliability, especially in the miniaturization of portable electronic devices.
Innovation Solution
The integrated circuit package system includes connecting an integrated circuit die and external interconnects, forming an encapsulation over the die and a portion of the interconnects, and creating isolation holes between the interconnects and the encapsulation to expose them, allowing for increased I/O density and flexibility in packaging configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional QFN packages are used with traditional molding and lead frame structures, then manufacturing cost is reduced, but I/O density and I/O count are limited
Solution Approach 1:
The package structure is segmented into distinct functional zones: an exposed pad area for I/O connections, a die attach area, and isolation regions. The isolation holes segment the encapsulation material to expose specific interconnect regions, allowing high-density I/O without requiring complex diagonal tie bar structures.
Solution Approach 2:
The invention transitions from traditional lateral I/O arrangements to a configuration where I/O interconnects are exposed through the thickness dimension of the package via isolation holes. This vertical exposure approach enables higher I/O density without increasing the package footprint or requiring complex lateral routing structures.
2Volume of moving object
If the package is miniaturized and thinned to reduce device size, then portability is improved, but manufacturing reliability deteriorates
Solution Approach 1:
The encapsulation material has different properties in different regions: areas with isolation holes have exposed interconnects for I/O access, while other areas maintain full encapsulation for protection. The die attach paddle provides localized mechanical support and thermal management where needed, while allowing miniaturization in other regions.
3Quantity of substance
If more I/O interconnects are packed into the package, then I/O density increases, but manufacturing complexity increases
Solution Approach 1:
The molding process automatically forms the encapsulation material around the die and lead frame, and the isolation holes are formed through the cured encapsulation to expose the I/O interconnects. This self-organizing process allows high I/O density without requiring complex manual assembly or additional manufacturing steps.
Data Source
AI summary
An integrated circuit package system includes: connecting an integrated circuit die and external interconnects; forming an encapsulation over the integrated circuit die and a portion of the external interconnects; and forming an isolation hole between the external interconnects and into a side of the encapsulation exposing the external interconnects.